DF2117VLP20V Renesas Electronics America, DF2117VLP20V Datasheet - Page 46

• Manufacturer Part Number: DF2117VLP20V
• Description: IC H8S/2117 MCU FLASH 145TFLGA
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2100r

Specifications of DF2117VLP20V

• Core Processor: H8S/2600
• Core Size: 16-Bit
• Speed: 20MHz
• Connectivity: FIFO, I²C, LPC, SCI, SmartCard
• Peripherals: POR, PWM, WDT
• Number Of I /o: 112
• Program Memory Size: 160KB (160K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 16x10b
• Oscillator Type: External
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 145-TFLGA
• For Use With: HS0005KCU11H - EMULATOR E10A-USB H8S(X),SH2(A)3DK2166 - DEV EVAL KIT H8S/2166
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

Section 25 List of Registers...............................................................................781
25.1 Register Addresses (Address Order).................................................................................. 782
25.2 Register Bits....................................................................................................................... 803
25.3 Register States in Each Operating Mode ........................................................................... 820
25.4 Register Selection Condition ............................................................................................. 834
25.5 Register Addresses (Classification by Type of Module).................................................... 854
Section 26 Electrical Characteristics .................................................................875
26.1 Absolute Maximum Ratings .............................................................................................. 875
26.2 DC Characteristics ............................................................................................................. 876
26.3 AC Characteristics ............................................................................................................. 881
26.4 A/D Conversion Characteristics......................................................................................... 896
26.5 Flash Memory Characteristics ........................................................................................... 897
26.6 Usage Notes ....................................................................................................................... 898
Appendix
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Index
Rev. 3.00 Sep. 28, 2009 Page xliv of xliv
REJ09B0350-0300
26.3.1 Clock Timing ........................................................................................................ 882
26.3.2 Control Signal Timing .......................................................................................... 884
26.3.3 Timing of On-Chip Peripheral Modules ............................................................... 886
I/O Port States in Each Pin State........................................................................................ 899
Product Lineup................................................................................................................... 900
Package Dimensions .......................................................................................................... 901
Treatment of Unused Pins.................................................................................................. 904
......................................................................................................... 899
.........................................................................................................905