TMP91xy16FG Toshiba, TMP91xy16FG Datasheet - Page 235

• Manufacturer Part Number: TMP91xy16FG
• Manufacturer: Toshiba

Specifications of TMP91xy16FG

• Package: LQFP100
• Rom Types(m=mask,p=otp, F=flash,e=eeprom): Romless
• Rom Combinations: Romless
• Ram Combinations: Ramless
• Architecture: 16-bit CISC
• Usb/spi Channels: -
• Uart/sio Channels: 1
• I2c/sio Bus Channels: -
• (s)dram Controller: 1
• Adc 10-bit Channel: -
• Da Converter: -
• Timer 8-bit Channel: 4
• Timer 16-bit Channel: -
• Pwm 8-bit Channels: -
• Pwm 16-bit Channels: -
• Cs/wait Controller: 4
• Dual Clock: Y
• Number Of I/o Ports: 31
• Power Supply Voltage(v): 2.7 to 3.6

4.
4.1
Solderability of lead free products
Electrical Characteristics
parameter
Solderability
Note: The absolute maximum ratings are rated values which must not be exceeded during
Absolute Maximum Ratings
Test
Power supply voltage
Input voltage
Output current
Output current
Output current (total)
Output current (total)
Power dissipation (Ta = 85°C)
Soldering temperature (10 s)
Storage temperature
Operating temperature
operation, even for an instant. Any one of the ratings must not be exceeded. If any
absolute maximum rating is exceeded, a device may break down or its performance
may be degraded, causing it to catch fire or explode resulting in injury to the user.
Thus, when designing products which include this device, ensure that no absolute
maximum rating value will ever be exceeded.
Parameter
Use of Sn-37Pb solder Bath
Solder bath temperature = 230°C, Dipping time = 5 seconds
The number of times = one, Use of R-type flux
Use of Sn-3.0Ag-0.5Cu solder bath
Solder bath temperature = 245°C, Dipping time = 5 seconds
The number of times = one, Use of R-type flux (use of lead free)
Vcc
VIN
IOL
IOH
ΣIOL
ΣIOH
PD
TSOLDER
TSTG
TOPR
Test condition
Symbol
91C016-233
−0.5 to Vcc + 0.5
−0.5 to 4.0
−65 to 150
−10 to 70
Rating
−80
600
260
−2
80
2
Pass:
solderability rate until forming ≥ 95%
Unit
mW
mA
°C
V
Note
TMP91C016
2008-02-20