HD64F2623FA20J Renesas Electronics America, HD64F2623FA20J Datasheet - Page 1065

IC H8S MCU FLASH 256K 100-QFP

HD64F2623FA20J

Manufacturer Part Number
HD64F2623FA20J
Description
IC H8S MCU FLASH 256K 100-QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2600r
Datasheets

Specifications of HD64F2623FA20J

Core Processor
H8S/2600
Core Size
16-Bit
Speed
20MHz
Connectivity
CAN, SCI, SmartCard
Peripherals
POR, PWM, WDT
Number Of I /o
53
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
12K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 16x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
100-QFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-

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Timing of Transition to Hardware Standby Mode
(1) To retain RAM contents with the RAME bit set to 1 in SYSCR, drive the RES signal low at
(2) To retain RAM contents with the RAME bit cleared to 0 in SYSCR, or when RAM contents do
Timing of Recovery from Hardware Standby Mode
Drive the RES signal low and the NMI signal high approximately 100 ns or more before STBY
goes high to execute a power-on reset.
Appendix E Timing of Transition to and Recovery from
least 10 states before the STBY signal goes low, as shown below. RES must remain low until
STBY signal goes low (delay from STBY low to RES high: 0 ns or more).
not need to be retained, RES does not have to be driven low as in (1).
STBY
RES
STBY
RES
NMI
Figure E.2 Timing of Recovery from Hardware Standby Mode
Figure E.1 Timing of Transition to Hardware Standby Mode
Appendix E Timing of Transition to and Recovery from Hardware Standby Mode
Hardware Standby Mode
t
1
10t
t
cyc
100ns
t
2
Rev. 5.00 Jan 10, 2006 page 1039 of 1042
0ns
t
OSC
t
NMIRH
REJ09B0275-0500

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