HD64F2623FA20J Renesas Electronics America, HD64F2623FA20J Datasheet - Page 669
HD64F2623FA20J
Manufacturer Part Number
HD64F2623FA20J
Description
IC H8S MCU FLASH 256K 100-QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2600r
Specifications of HD64F2623FA20J
Core Processor
H8S/2600
Core Size
16-Bit
Speed
20MHz
Connectivity
CAN, SCI, SmartCard
Peripherals
POR, PWM, WDT
Number Of I /o
53
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
12K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 16x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
100-QFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
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19.6.1
When boot mode is used, the flash memory programming control program must be prepared in the
host beforehand. The SCI channel to be used is set to asynchronous mode.
When a reset-start is executed after the H8S/2626 or H8S/2623 pins have been set to boot mode,
the boot program built into the LSI is started and the programming control program prepared in
the host is serially transmitted to the LSI via the SCI. In the H8S/2626 and H8S/2623, the
programming control program received via the SCI is written into the programming control
program area in on-chip RAM. After the transfer is completed, control branches to the start
address of the programming control program area and the programming control program execution
state is entered (flash memory programming is performed).
The transferred programming control program must therefore include coding that follows the
programming algorithm given later.
The system configuration in boot mode is shown in figure 19.6, and the boot mode execution
procedure in figure 19.7.
Boot Mode
Host
Figure 19.6 System Configuration in Boot Mode
Verify data transmission
Write data reception
Rev. 5.00 Jan 10, 2006 page 643 of 1042
RxD2
TxD2
H8S/2626 or H8S/2623
SCI2
Section 19 ROM (Preliminary)
Flash memory
On-chip RAM
REJ09B0275-0500
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