HD64F2623FA20J Renesas Electronics America, HD64F2623FA20J Datasheet - Page 707

IC H8S MCU FLASH 256K 100-QFP

HD64F2623FA20J

Manufacturer Part Number
HD64F2623FA20J
Description
IC H8S MCU FLASH 256K 100-QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2600r
Datasheets

Specifications of HD64F2623FA20J

Core Processor
H8S/2600
Core Size
16-Bit
Speed
20MHz
Connectivity
CAN, SCI, SmartCard
Peripherals
POR, PWM, WDT
Number Of I /o
53
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
12K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 16x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
100-QFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HD64F2623FA20J
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Part Number:
HD64F2623FA20J
Manufacturer:
HIT
Quantity:
1 000
Part Number:
HD64F2623FA20J
Manufacturer:
HITACHI/日立
Quantity:
20 000
Part Number:
HD64F2623FA20JV
Manufacturer:
RENESAS/瑞萨
Quantity:
20 000
4. Do not apply a constant high level to the FWE pin.
5. Use the recommended algorithm when programming and erasing flash memory.
6. Do not set or clear the SWE1 bit during execution of a program in flash memory.
7. Do not use interrupts while flash memory is being programmed or erased.
8. Do not perform additional programming. Erase the memory before reprogramming.
9. Before programming, check that the chip is correctly mounted in the PROM
10. Do not touch the socket adapter or chip during programming.
Apply a high level to the FWE pin only when programming or erasing flash memory. A
system configuration in which a high level is constantly applied to the FWE pin should be
avoided. Also, while a high level is applied to the FWE pin, the watchdog timer should be
activated to prevent overprogramming or overerasing due to program runaway, etc.
The recommended algorithm enables programming and erasing to be carried out without
subjecting the device to voltage stress or sacrificing program data reliability. When setting the
P1 or E1 bit in FLMCR1, the watchdog timer should be set beforehand as a precaution against
program runaway, etc.
Do not set or clear the SWE1 bit during execution of a program in flash memory. Wait for at
least 100 µs after clearing the SWE1 bit before executing a program or reading data in flash
memory. When the SWE1 bit is set, data in flash memory can be rewritten, but when SWE1 =
1, flash memory can only be read in program-verify or erase-verify mode. Access flash
memory only for verify operations (verification during programming/erasing). Do not clear the
SWE1 bit during programming, erasing, or verifying.
Similarly, when using the RAM emulation function while a high level is being input to the
FWE pin, the SWE1 bit must be cleared before executing a program or reading data in flash
memory. However, the RAM area overlapping flash memory space can be read and written to
regardless of whether the SWE1 bit is set or cleared.
All interrupt requests, including NMI, should be disabled during FWE application to give
priority to program/erase operations.
In on-board programming, perform only one programming operation on a 128-byte
programming unit block. In programmer mode, also, perform only one programming operation
on a 128-byte programming unit block.
programmer.
Overcurrent damage to the device can result if the index marks on the PROM programmer
socket, socket adapter, and chip are not correctly aligned.
Touching either of these can cause contact faults and write errors.
Rev. 5.00 Jan 10, 2006 page 681 of 1042
Section 19 ROM (Preliminary)
REJ09B0275-0500

Related parts for HD64F2623FA20J