HD64F2623FA20J Renesas Electronics America, HD64F2623FA20J Datasheet - Page 710

• Manufacturer Part Number: HD64F2623FA20J
• Description: IC H8S MCU FLASH 256K 100-QFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2600r

Specifications of HD64F2623FA20J

• Core Processor: H8S/2600
• Core Size: 16-Bit
• Speed: 20MHz
• Connectivity: CAN, SCI, SmartCard
• Peripherals: POR, PWM, WDT
• Number Of I /o: 53
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 12K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 16x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 100-QFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

Section 19 ROM (Preliminary)
Rev. 5.00 Jan 10, 2006 page 684 of 1042
REJ09B0275-0500
Notes: 1. When entering boot mode or making a transition from boot mode to another mode, mode switching must be carried
VCC
FWE
MD2 to MD0
RES
SWE1 bit
Period during which flash memory access is prohibited
(x: Wait time after setting SWE1 bit)
Period during which flash memory can be programmed
(Execution of program in flash memory prohibited, and data reads other than verify operations prohibited)
2. When making a transition from boot mode to another mode, a mode programming setup time, t
3. See section 22.6, Flash Memory Characteristics.
out by means of RES input. The state of ports with multiplexed address functions and bus control output pins
(AS, RD, WR) will change during this switchover interval (the interval during which the RES pin input is low),
and therefore these pins should not be used as output signals during this time.
is necessary with respect to the RES clearance timing.
(Example: Boot Mode
t
OSC1
SWE1 set
Mode
change
t
MDS
t
MDS
*1
Figure 19.28 Mode Transition Timing
*3
Boot
mode
Mode
change
SWE1
cleared
t
RESW
Min 0 s
t
MDS
User Mode
*1
*2
User
mode
User program mode
User Program Mode)
User
mode
MDS
(min), of 200 ns
User program
mode