MC68EN360AI25VL Freescale, MC68EN360AI25VL Datasheet - Page 68

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MC68EN360AI25VL

Manufacturer Part Number
MC68EN360AI25VL
Description
Manufacturer
Freescale
Datasheet

Specifications of MC68EN360AI25VL

Family Name
M68000
Device Core
ColdFire
Device Core Size
32b
Frequency (max)
25MHz
Instruction Set Architecture
RISC
Operating Supply Voltage (max)
3.3V
Operating Supply Voltage (min)
2.7V
Operating Temp Range
0C to 70C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
240
Package Type
FQFP
Lead Free Status / RoHS Status
Compliant

Available stocks

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Part Number
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Quantity
Price
Part Number:
MC68EN360AI25VL
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Part Number:
MC68EN360AI25VL
Manufacturer:
FREESCALE
Quantity:
1 000
Part Number:
MC68EN360AI25VL
Manufacturer:
FREESCALE
Quantity:
20 000
Freescale Semiconductor, Inc.
QUICC Memory Map
MBAR (SIM)
DPRBASE (DUAL-PORT RAM BASE)
DUAL-PORT RAM
4KB
REGB (REGISTER BASE) = DPRBASE + 4K
INTERNAL
4KB
REGISTERS
Figure 3-1. QUICC Memory Map
3.1 DUAL-PORT RAM MEMORY MAP
The internal 2816-byte (2560-byte on REV A and B mask) dual-port RAM is partitioned to
1792 bytes (1536 bytes on REV A and B mask) of system RAM, 256-byte microcode scratch
area, and 768 bytes of parameter RAM (see Table 3-1). Its base address, called dual-port
RAM base (DPRBASE), is the address pointed to by the MBAR.
NOTE
Rev A mask is C63T, Rev B mask are C69T, and F35G
The system RAM may be used for microcode program area, data area, and buffer descrip-
tors (BDs). It may be partitioned in several ways, allowing programmable partition sizes to
fit the system requirements. This is described in Section 7 Communication Processor Mod-
ule (CPM).
3-2
MC68360 USER’S MANUAL
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