MC68EN360AI25VL Freescale, MC68EN360AI25VL Datasheet - Page 726

• Manufacturer Part Number: MC68EN360AI25VL
• Manufacturer: Freescale

Specifications of MC68EN360AI25VL

• Family Name: M68000
• Device Core: ColdFire
• Device Core Size: 32b
• Frequency (max): 25MHz
• Instruction Set Architecture: RISC
• Operating Supply Voltage (max): 3.3V
• Operating Supply Voltage (min): 2.7V
• Operating Temp Range: 0C to 70C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 240
• Package Type: FQFP
• Lead Free Status / RoHS Status: Compliant

Applications
During initialization, CS0 should be programmed to respond to a 256-Kbyte area in this
design.
9.1.2.4 SRAM. Figure 9-4 shows the glueless interface to an SRAM. In this case, a full 32-
bit-wide SRAM bank is assumed, but an 8- or 16-bit-wide bank would also be possible at the
expense of performance. The CS3 pin should be programmed to respond to a 128-Kbyte
area in this design.
9-6
Figure 9-3. Glueless Interface to Flash EPROM
CS0
OE
A17–A0
WE0
D31–D24
SYSTEM BUS AND
QUICC-GENERATED SIGNALS
Freescale Semiconductor, Inc.
For More Information On This Product,
MC68360 USER’S MANUAL
Go to: www.freescale.com
+12V
DQ0
DQ1
DQ2
DQ3
DQ4
DQ5
DQ6
DQ7
VPP
OE
WE (Write)
CE (Enable)
FLASH EPROM
256K 8
PORT SIZE
27F020
BYTE
A14
A10
A11
A12
A13
A15
A16
A17
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9