UPD78F1506GF-GAT-AX Renesas Electronics America, UPD78F1506GF-GAT-AX Datasheet - Page 942

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UPD78F1506GF-GAT-AX

Manufacturer Part Number
UPD78F1506GF-GAT-AX
Description
MCU 16BIT 78K0R/LX3 128-LQFP
Manufacturer
Renesas Electronics America
Series
78K0R/Lx3r
Datasheet

Specifications of UPD78F1506GF-GAT-AX

Core Processor
78K/0R
Core Size
16-Bit
Speed
20MHz
Connectivity
3-Wire SIO, I²C, LIN, UART/USART
Peripherals
DMA, LCD, LVD, POR, PWM, WDT
Number Of I /o
78
Program Memory Size
64KB (64K x 8)
Program Memory Type
FLASH
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 5.5 V
Data Converters
A/D 12x12b, D/A 2x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
*
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
<R>
78K0R/Lx3
sales representative.
Note
Caution
R01UH0004EJ0401 Rev.4.01
Jul 2, 2010
Infrared reflow
Partial heating
Soldering Method
These products should be soldered and mounted under the following recommended conditions.
For soldering methods and conditions other than those recommended below, please contact a Renesas Electronics
For technical information, see the following website.
Semiconductor Device Mount Manual (http://www2.renesas.com/pkg/en/mount/index.html)
(1) 80-pin plastic LQFP (fine pitch) (12×12)
100-pin plastic LQFP (fine pitch) (14x14)
128-pin plastic LQFP (fine pitch) (14x20)
After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.
μ
μ
μ
PD78F1500AGK-GAK-AX, 78F1501AGK-GAK-AX, 78F1502AGK-GAK-AX
PD78F1503AGC-UEU-AX, 78F1504AGC-UEU-AX, 78F1505AGC-UEU-AX
PD78F1506AGF-GAT-AX, 78F1507AGF-GAT-AX, 78F1508AGF-GAT-AX
The
and evaluation. Do not use the on-chip debug function in products designated for mass production,
because the guaranteed number of rewritable times of the flash memory may be exceeded when this
function is used, and product reliability therefore cannot be guaranteed. Renesas Electronics is not
liable for problems occurring when the on-chip debug function is used.
μ
PD78F1500A to 78F1508A have an on-chip debug function, which is provided for development
Package peak temperature: 260°C, Time: 60 seconds max. (at 220°C or higher),
Count: 3 times or less, Exposure limit: 7 days
10 to 72 hours)
Pin temperature: 350°C max., Time: 3 seconds max. (per pin row)
CHAPTER 33 RECOMMENDED SOLDERING CONDITIONS
Table 33-1. Surface Mounting Type Soldering Conditions (1/2)
Soldering Conditions
CHAPTER 33 RECOMMENDED SOLDERING CONDITIONS
Note
(after that, prebake at 125°C for
IR60-107-3
Condition Symbol
Recommended
942

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