UPD78F1506GF-GAT-AX Renesas Electronics America, UPD78F1506GF-GAT-AX Datasheet - Page 943

• Manufacturer Part Number: UPD78F1506GF-GAT-AX
• Description: MCU 16BIT 78K0R/LX3 128-LQFP
• Manufacturer: Renesas Electronics America
• Series: 78K0R/Lx3r

Specifications of UPD78F1506GF-GAT-AX

• Core Processor: 78K/0R
• Core Size: 16-Bit
• Speed: 20MHz
• Connectivity: 3-Wire SIO, I²C, LIN, UART/USART
• Peripherals: DMA, LCD, LVD, POR, PWM, WDT
• Number Of I /o: 78
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• Ram Size: 4K x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 5.5 V
• Data Converters: A/D 12x12b, D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: *
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

78K0R/Lx3
Note
Caution
R01UH0004EJ0401 Rev.4.01
Jul 2, 2010
Infrared reflow
Wave soldering
Partial heating
Soldering Method
(2) 80-pin plastic LQFP (14×14)
After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.
μ
PD78F1500AGC-GAD-AX, 78F1501AGC-GAD-AX, 78F1502AGC-GAD-AX
The
and evaluation. Do not use the on-chip debug function in products designated for mass production,
because the guaranteed number of rewritable times of the flash memory may be exceeded when this
function is used, and product reliability therefore cannot be guaranteed. Renesas Electronics is not
liable for problems occurring when the on-chip debug function is used.
μ
PD78F1500A to 78F1508A have an on-chip debug function, which is provided for development
Package peak temperature: 260°C, Time: 60 seconds max. (at 220°C or higher),
Count: 3 times or less, Exposure limit: 7 days
10 to 72 hours)
Solder bath temperature: 260°C max., Time: 10 seconds max., Count: Once,
Preheating temperature: 120°C max. (package surface temperature),
Exposure limit: 7 days
Pin temperature: 350°C max., Time: 3 seconds max. (per pin row)
Table 33-1. Surface Mounting Type Soldering Conditions (2/2)
Note
(after that, prebake at 125°C for 10 to 72 hours)
Soldering Conditions
CHAPTER 33 RECOMMENDED SOLDERING CONDITIONS
Note
(after that, prebake at 125°C for
IR60-107-3
WS60-107-1
Condition Symbol
Recommended
−
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