MPC8544DS Freescale Semiconductor, MPC8544DS Datasheet - Page 12

• Manufacturer Part Number: MPC8544DS
• Description: BOARD DEVELOPMENT SYSTEM 8544
• Manufacturer: Freescale Semiconductor
• Series: PowerQUICC III™r
• Type: MPUr

Specifications of MPC8544DS

• Contents: Board
• Processor To Be Evaluated: MPC8544E
• Data Bus Width: 32 bit
• Interface Type: Ethernet, I2C
• Operating Supply Voltage: - 0.3 V to + 1.1 V
• Leaded Process Compatible: Yes
• Peak Reflow Compatible (260 C): Yes
• Rohs Compliant: Yes
• For Use With/related Products: MPC8544
• For Use With: PPC8544EVTANG - EVAL MPC8544 783FCPBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Paragraph
Number
7.3.1.2.3
7.3.1.3
7.3.1.3.1
7.3.1.3.2
7.3.1.4
7.3.1.4.1
7.3.1.4.2
7.4
7.4.1
7.5
7.6
7.6.1
7.6.2
7.7
7.7.1
7.7.2
7.7.3
7.7.4
7.7.5
7.7.6
7.8
7.8.1
7.8.2
7.9
7.9.1
7.9.1.1
7.9.1.2
7.9.2
7.9.3
7.9.3.1
7.9.3.2
7.9.4
7.9.5
7.9.6
xii
MPC8544E PowerQUICC III Integrated Host Processor Family Reference Manual, Rev. 1
External Writes to the L2 Cache (Cache Stashing)........................................................ 7-25
L2 Cache Timing ........................................................................................................... 7-27
L2 Cache and SRAM Coherency................................................................................... 7-27
L2 Cache Locking.......................................................................................................... 7-29
PLRU L2 Replacement Policy....................................................................................... 7-31
L2 Cache Operation ....................................................................................................... 7-33
Stash-Only Cache Regions ........................................................................................ 7-26
L2 Cache Coherency Rules........................................................................................ 7-28
Memory-Mapped SRAM Coherency Rules .............................................................. 7-29
Locking the Entire L2 Cache ..................................................................................... 7-29
Locking Programmed Memory Ranges..................................................................... 7-30
Locking Selected Lines.............................................................................................. 7-30
Clearing Locks on Selected Lines ............................................................................. 7-30
Flash Clearing of Instruction and Data Locks ........................................................... 7-31
Locks with Stale Data ................................................................................................ 7-31
PLRU Bit Update Considerations.............................................................................. 7-32
Allocation of Lines .................................................................................................... 7-32
Initialization ............................................................................................................... 7-33
Flash Invalidation of the L2 Cache............................................................................ 7-34
Managing Errors ........................................................................................................ 7-34
L2 Cache States ......................................................................................................... 7-34
L2 State Transitions ................................................................................................... 7-35
Error Checking and Correcting (ECC) ...................................................................... 7-39
L2 Memory-Mapped SRAM Registers ................................................................. 7-15
L2 Error Registers.................................................................................................. 7-17
L2 Cache Initialization .......................................................................................... 7-33
Memory-Mapped SRAM Initialization ................................................................. 7-33
ECC Errors............................................................................................................. 7-34
Tag Parity Errors.................................................................................................... 7-34
L2 Cache External Write Control Registers 0–3 (L2CEWCRn)....................... 7-14
L2 Memory-Mapped SRAM Base Address Registers 0–1 (L2SRBARn) ........ 7-16
L2 Memory-Mapped SRAM Base Address Registers Extended Address 0–1
Error Injection Registers.................................................................................... 7-18
Error Control and Capture Registers ................................................................. 7-20
(L2SRBAREAn)............................................................................................ 7-17
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