SAM9G45 Atmel Corporation, SAM9G45 Datasheet - Page 1180

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SAM9G45

Manufacturer Part Number
SAM9G45
Description
Manufacturer
Atmel Corporation
Datasheets

Specifications of SAM9G45

Flash (kbytes)
0 Kbytes
Pin Count
324
Max. Operating Frequency
400 MHz
Cpu
ARM926
Hardware Qtouch Acquisition
No
Max I/o Pins
160
Ext Interrupts
160
Usb Transceiver
3
Usb Speed
Hi-Speed
Usb Interface
Host, Device
Spi
2
Twi (i2c)
2
Uart
5
Lin
4
Ssc
2
Ethernet
1
Sd / Emmc
2
Graphic Lcd
Yes
Video Decoder
No
Camera Interface
Yes
Adc Channels
8
Adc Resolution (bits)
10
Adc Speed (ksps)
440
Resistive Touch Screen
Yes
Temp. Sensor
No
Crypto Engine
No
Sram (kbytes)
64
Self Program Memory
NO
External Bus Interface
2
Dram Memory
DDR2/LPDDR, SDRAM/LPSDR
Nand Interface
Yes
Picopower
No
Temp. Range (deg C)
-40 to 85
I/o Supply Class
1.8/3.3
Operating Voltage (vcc)
0.9 to 1.1
Fpu
No
Mpu / Mmu
No/Yes
Timers
6
Output Compare Channels
6
Input Capture Channels
6
Pwm Channels
4
32khz Rtc
Yes
Calibrated Rc Oscillator
No
1180
Doc. Rev
6438F
SAM9G45
Comments
Bus Matrix
- EBI_DRIVE and DDR_DRIVE bitfields edited in
- “12-layer” Matrix instead of “11-layer”
DDRSDRC
In
- TRTP bitfield reset value (0 --> 2) changed.
- 0 and 15’ cycles changed into ‘0 and 7’ in ”TRTP: Read to Precharge”.
- TXARD (-->2), TXARDS (-->6), and TRPA (-->0) reset values changed.
In
In
Electrical Characteristics
- Figure below
-
-
- Ultra low power Mode value changed in
-
Errata
-
-
-
-
- 3
ECC parity”
Nand Flash”
External Memories
- DQM0-3 added to
-
-
-
- On
LPDDR’ --> ‘DDRSDRC20’.
- All ‘DDR2SDRC’ changed into ‘DDRSDRC’.
Mechanical Characteristics
- New
- All ‘nominal’ changed into ‘typical’.
- An empty square after letter ‘V’ removed from the
PMC
- Note added to
Register”.
USART
- LIN Mode condition now shown in
Transmitter
Section 46.14 “DDRSDRC Timings”
Table 46-17 “I/O Characteristics”
Section 46.15.1.1 “Maximum SPI Frequency”
“Boot ROM”
“Static Memory Controller (SMC)”
“Touch Screen (TSADCC)”
“USB High Speed Host Port (UHPHS)”
Table
Section 20.2.7.7 “NAND Flash Support”
Section 20. “External Memories”
Section 22.7.6 “DDRSDRC Timing 2 Parameter
Section 22.7.7 “DDRSDRC Low-power
Section 22.4.4.1 “Self Refresh
“Error Corrected Code Controller (ECC)”
Figure 6-1 “SAM9G45 Memory
Figure 47-1 “324-ball TFBGA Package Drawing”
20-5, row ‘A15’ edited.
(USART)”.
,
“ECC: Unsupported ECC per 512 words”
errata added.
Table 46-7, “Main Oscillator Characteristics”
Section 25.4 “Master Clock
Figure 20-4 “EBI Connections to Memory
errata added.
Mode”, UDP_EN bitfield replaced by UPD_MR.
reorganized.
and Notes below edited.
errata added.
Section 33. “Universal Synchronous Asynchronous Receiver
Mapping”, ‘DDR2-LPDDR-SDRAM’ --> ‘DDRSDRC1’ and ‘DDR2-
updated.
errata added.
Table 46-3, “Power Consumption for Different
edited.
Register”, UPD_MR bitfield added to the table at [21:20].
Controller”and
errata added:
added.
“EBI Chip Select Assignment Register”
Register”,
Section 49.1 “Marking”
and
and Max. weight changed in
“ECC: Uncomplete parity status when error in
Section 25.12.12 “PMC Master Clock
“ECC: Unsupported hardware ECC on 16-bit
edited.
Devices”.
table.
Table 47-2
Modes”.
6438G–ATARM–19-Apr-11
Change
Request
Ref.
6930
7171
7134
7146
7063
7134 -7193
6926
7195
7173
7148
6977
7165
7194
7192
7123
7027
6924
6946
6954
RFO
7106
6944

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