tm1300 NXP Semiconductors, tm1300 Datasheet - Page 34

• Manufacturer Part Number: tm1300
• Description: Tm-1300 Media Processor
• Manufacturer: NXP Semiconductors

TM1300 Data Book
1.7
BGA292 ball grid array package; 256 balls + 36 center ground & thermal balls; body 27 x 27 x 1.55 mm.
1.8
To order 143-MHz v1.2 TM-1300 parts, refer to part number ‘PTM1300AEBEA’, 12 nc product code 9352 6691 7557.
To order 166-MHz v1.2 TM-1300 parts, refer to part number ‘PTM1300FBEA’, 12 nc product code 9352 6687 1557.
SOT number is 553AA1.
1-10
PACKAGE
ORDERING INFORMATION
4.0X45˚
CHAM
A
W
U
R
N
M
K
H
G
D
C
B
A
Y
V
T
P
L
J
F
E
1
1
2
2
3
3
PRODUCT SPECIFICATION
4
4
5
5
1.27
8.5 0.10
6
6
BOTTOM VIEW
7
7
SIDE VIEW
24.00 0
TOP VIEW
24.00 REF.
8
8
27.00 0.10
27.00 0.10
9
9
24.13
10
10
11
11
0.10
12
12
13
13
14
14
15
15
=30˚ 5˚
16
16
17
17
18
18
19
19
20
20
W
M
Y
V
U
R
P
N
K
H
G
E
D
C
B
A
T
L
J
F
Note 2
R 0.625X3
ø2.0 0.10
(Heat Slug)
ø17mm
NOTES
1. Units in mm.
2. Ground pins to be connected
DETAIL "A"
to thermally conductive ground
plane.
Philips Semiconductors
Solder Ball
0.75 0.15