R5F61663RN50FPV Renesas Electronics America, R5F61663RN50FPV Datasheet - Page 1496

• Manufacturer Part Number: R5F61663RN50FPV
• Description: MCU FLASH 384K ROM 144-LQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8SX/1600r

Specifications of R5F61663RN50FPV

• Core Processor: H8SX
• Core Size: 16/32-Bit
• Speed: 50MHz
• Connectivity: EBI/EMI, I²C, IrDA, SCI, SmartCard, USB
• Peripherals: DMA, LVD, POR, PWM, WDT
• Number Of I /o: 92
• Program Memory Size: 384KB (384K x 8)
• Program Memory Type: FLASH
• Ram Size: 40K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: External
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 144-LQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

Cluster transfer modes ............................ 481
Cluster transfer read address mode......... 533
Cluster transfer write address mode ....... 535
Communications protocol..................... 1176
Compare match A................................... 834
Compare match B ................................... 835
Compare match count mode ................... 837
Compare match signal ............................ 834
Control transfer..................................... 1012
Counter operation ................................... 730
CPU priority control function over
DTC and DMAC .................................... 165
CRC operation circuit............................. 958
Crystal resonator................................... 1227
Cycle steal mode..................................... 491
Cycle stealing mode................................ 413
D
D/A converter ....................................... 1097
Data direction register ............................ 604
Data register............................................ 605
Data stage ............................................. 1014
Data transfer controller (DTC) ............... 559
Direct convention ................................... 937
DMA controller (DMAC)....................... 375
Double-buffered structure....................... 912
Download pass/fail result parameter..... 1127
DRAM interface ..................................... 280
DRAM Interface ..................................... 234
DTC vector address ................................ 571
DTC vector address offset ...... 571, 572, 573
Dual address mode.......................... 402, 482
E
Endian and data alignment ..................... 241
Endian format ......................................... 232
Error protection .................................... 1168
Error signal ............................................. 937
Rev. 2.00 Sep. 24, 2008 Page 1462 of 1468
REJ09B0412-0200
Exception handling ................................. 113
Exception-handling state........................... 76
EXDMA controller (EXDMAC) ............ 453
Extended repeat area ............................... 399
Extended repeat area function......... 415, 492
Extension of chip select (CS) assertion
period ...................................................... 254
External access bus ................................. 220
External bus ............................................ 225
External bus clock (Bφ) ................ 221, 1221
External bus interface ............................. 231
External clock ....................................... 1228
External interrupts................................... 147
F
Flash erase block select parameter........ 1136
Flash memory ....................................... 1105
Flash multipurpose address area
parameter .............................................. 1134
Flash multipurpose data destination
parameter .............................................. 1135
Flash pass and fail parameter ................ 1128
Flash program/erase frequency
parameter .................................... 1132, 1151
Free-running count operation.................. 731
Frequency divider ....................... 1221, 1229
Full address mode ................................... 569
Full-scale error...................................... 1090
G
General illegal instructions ..................... 126
H
Hardware protection ............................. 1167
Hardware standby mode ............. 1236, 1279