R5F61663RN50FPV Renesas Electronics America, R5F61663RN50FPV Datasheet - Page 395

MCU FLASH 384K ROM 144-LQFP

R5F61663RN50FPV

Manufacturer Part Number
R5F61663RN50FPV
Description
MCU FLASH 384K ROM 144-LQFP
Manufacturer
Renesas Electronics America
Series
H8® H8SX/1600r
Datasheets

Specifications of R5F61663RN50FPV

Core Processor
H8SX
Core Size
16/32-Bit
Speed
50MHz
Connectivity
EBI/EMI, I²C, IrDA, SCI, SmartCard, USB
Peripherals
DMA, LVD, POR, PWM, WDT
Number Of I /o
92
Program Memory Size
384KB (384K x 8)
Program Memory Type
FLASH
Ram Size
40K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
144-LQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
R5F61663RN50FPV
Manufacturer:
Renesas Electronics America
Quantity:
10 000
• When SCKCR is written to set the clock frequencies
If an external bus release request, external access, and a refresh request occur simultaneously, the
order of priority is as follows:
9.13.2
Table 9.32 shows pin states in the external bus released state.
Table 9.32 Pin States in Bus Released State
Pins
A23 to A0
D15 to D0
BS
CSn (n = 7 to 0)
AS
AH
RD/WR
LUCAS, LLCAS
RD
RAS
CAS
WE
DQMLU, DQMLL
CKE
OE
LUB, LLB
LHWR, LLWR
DACKn (n = 3 to 0)
EDACKn (n = 3 to 0)
Refresh > EXDMAC > External bus release > External access by CPU, DTC, and
DMAC
Pin States in External Bus Released State
Pin State
High impedance
High impedance
High impedance
High impedance
High impedance
High impedance
High impedance
High impedance
High impedance
High impedance
High impedance
High impedance
High impedance
High impedance
High impedance
High impedance
High impedance
High
High
Rev. 2.00 Sep. 24, 2008 Page 361 of 1468
Section 9 Bus Controller (BSC)
REJ09B0412-0200

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