ATSAM3U-EK Atmel, ATSAM3U-EK Datasheet - Page 1147

• Manufacturer Part Number: ATSAM3U-EK
• Description: KIT EVAL FOR AT91SAM3U CORTEX
• Manufacturer: Atmel
• Type: MCUr

Specifications of ATSAM3U-EK

• Contents: Board
• Processor To Be Evaluated: SAM3U
• Data Bus Width: 32 bit
• Interface Type: RS-232, USB
• Operating Supply Voltage: 3 V
• Silicon Manufacturer: Atmel
• Core Architecture: ARM
• Core Sub-architecture: Cortex - M3
• Silicon Core Number: SAM3U4E
• Silicon Family Name: SAM3U
• Kit Contents: Board CD Docs
• Rohs Compliant: Yes
• For Use With/related Products: AT91SAM3U
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

44.5
44.6
6430D–ATARM–25-Mar-11
Soldering Profile
Packaging Resources
Table 44-15
Table 44-15. Soldering Profile
Note:
A maximum of three reflow passes is allowed per component.
Land Pattern Definition.
Refer to the following IPC Standards:
Profile Feature
Average Ramp-up Rate (217°C to Peak)
Preheat Temperature 175°C ±25°C
Temperature Maintained Above 217°C
Time within 5° C of Actual Peak Temperature
Peak Temperature Range
Ramp-down Rate
Time 25° C to Peak Temperature
• IPC-7351A and IPC-782 (Generic Requirements for Surface Mount Design and Land Pattern
• Atmel Green and RoHS Policy and Package Material Declaration Data Sheet
Standards)
http://www.atmel.com/green/
The package is certified to be backward compatible with Pb/Sn soldering profile.
gives the recommended soldering profile from J-STD-020C.
http://landpatterns.ipc.org/default.asp
3° C/sec. max.
180 sec. max.
Green Package
60 sec. to 150 sec.
20 sec. to 40 sec.
260° C
6° C/sec. max.
8 min. max.
SAM3U Series
1147