PNX1500E NXP Semiconductors, PNX1500E Datasheet - Page 110
PNX1500E
Manufacturer Part Number
PNX1500E
Description
Manufacturer
NXP Semiconductors
Datasheet
1.PNX1500E.pdf
(828 pages)
Specifications of PNX1500E
Lead Free Status / Rohs Status
Not Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PNX1500E
Manufacturer:
NORTEL
Quantity:
1 000
- Current page: 110 of 828
- Download datasheet (4Mb)
NXP Semiconductors
Volume 1 of 1
PNX15XX_PNX952X_SER_N_4
Product data sheet
2.1 The PCI View
Before going into the details of the three different views the following generic rules
should be noted:
These apertures need to be programmed at boot time or by the host before the
system can be operational. The internal boot scripts have pre-defined values for
these apertures (refer to
The PCI module provides three different apertures to the external PCI bus masters:
Any supported request on the PCI bus that falls outside of these three apertures is
discarded by the PCI module and therefore does not interfere with the PNX15xx/952x
Series system.
In addition PCI transactions to the XIO aperture from external PCI agents are
discarded.
Figure 2
PNX15xx/952x Series system. The apertures can be placed in any order with respect
to each other.
The aperture locations is programmed by the host CPU.
The aperture sizes can be programmed at boot time via some GPIO/BOOT_MODE[]
pins as defined in
CPU using PCI configuration cycles.
•
•
•
•
•
•
•
•
•
•
The three views must be consistent. For example, it is not allowed to have a
different DRAM aperture location for the TM3260 CPU and the PCI module.
The apertures are “naturally aligned”. For example a 32-Megabyte aperture has a
starting address that is a multiple of 32 Megabytes.
Each aperture can be located anywhere in the 32-bit addressing space.
All the modules in the PNX15xx/952x Series SOC sees the same memory map,
i.e. an address represents an unique location for all the modules.
the MMIO aperture, used to access all the internal PNX15xx/952x Series
registers. See
the DRAM aperture, used to access to the main memory of PNX15xx/952x
Series.
the XIO aperture, used by TM3260 to access low speed slave devices like Flash
memories or IDE disk drives.
The MMIO aperture is starting at the address contained in the BASE_14 PCI
configuration space register.
The DRAM aperture is starting at the address contained in the BASE_10 PCI
configuration space register.
The XIO aperture is starting at the address contained in the BASE_18 PCI
configuration space register.
presents the memory map seen by the PCI module and the remaining of the
Rev. 4.0 — 03 December 2007
Chapter 6 Boot Module
Section 11. on page 3-139
Chapter 6 Boot
Module).
or they can be programmed by the host
Chapter 3: System On Chip Resources
for offset allocation per module.
PNX15xx/952x Series
© NXP B.V. 2007. All rights reserved.
3-110
Related parts for PNX1500E
Image
Part Number
Description
Manufacturer
Datasheet
Request
R
Part Number:
Description:
NXP Semiconductors designed the LPC2420/2460 microcontroller around a 16-bit/32-bitARM7TDMI-S CPU core with real-time debug interfaces that include both JTAG andembedded trace
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
NXP Semiconductors designed the LPC2458 microcontroller around a 16-bit/32-bitARM7TDMI-S CPU core with real-time debug interfaces that include both JTAG andembedded trace
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
NXP Semiconductors designed the LPC2468 microcontroller around a 16-bit/32-bitARM7TDMI-S CPU core with real-time debug interfaces that include both JTAG andembedded trace
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
NXP Semiconductors designed the LPC2470 microcontroller, powered by theARM7TDMI-S core, to be a highly integrated microcontroller for a wide range ofapplications that require advanced communications and high quality graphic displays
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
NXP Semiconductors designed the LPC2478 microcontroller, powered by theARM7TDMI-S core, to be a highly integrated microcontroller for a wide range ofapplications that require advanced communications and high quality graphic displays
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
The Philips Semiconductors XA (eXtended Architecture) family of 16-bit single-chip microcontrollers is powerful enough to easily handle the requirements of high performance embedded applications, yet inexpensive enough to compete in the market for hi
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
The Philips Semiconductors XA (eXtended Architecture) family of 16-bit single-chip microcontrollers is powerful enough to easily handle the requirements of high performance embedded applications, yet inexpensive enough to compete in the market for hi
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
The XA-S3 device is a member of Philips Semiconductors? XA(eXtended Architecture) family of high performance 16-bitsingle-chip microcontrollers
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
The NXP BlueStreak LH75401/LH75411 family consists of two low-cost 16/32-bit System-on-Chip (SoC) devices
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
The NXP LPC3130/3131 combine an 180 MHz ARM926EJ-S CPU core, high-speed USB2
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
The NXP LPC3141 combine a 270 MHz ARM926EJ-S CPU core, High-speed USB 2
Manufacturer:
NXP Semiconductors
Part Number:
Description:
The NXP LPC3143 combine a 270 MHz ARM926EJ-S CPU core, High-speed USB 2
Manufacturer:
NXP Semiconductors
Part Number:
Description:
The NXP LPC3152 combines an 180 MHz ARM926EJ-S CPU core, High-speed USB 2
Manufacturer:
NXP Semiconductors
Part Number:
Description:
The NXP LPC3154 combines an 180 MHz ARM926EJ-S CPU core, High-speed USB 2
Manufacturer:
NXP Semiconductors
Part Number:
Description:
Standard level N-channel enhancement mode Field-Effect Transistor (FET) in a plastic package using NXP High-Performance Automotive (HPA) TrenchMOS technology
Manufacturer:
NXP Semiconductors
Datasheet: