HD64F2168VTE33 Renesas Electronics America, HD64F2168VTE33 Datasheet - Page 273

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HD64F2168VTE33

Manufacturer Part Number
HD64F2168VTE33
Description
Manufacturer
Renesas Electronics America
Datasheet

Specifications of HD64F2168VTE33

Cpu Family
H8S
Device Core Size
16/32Bit
Frequency (max)
33MHz
Interface Type
I2C/IrDA/SCI
Program Memory Type
Flash
Program Memory Size
256KB
Total Internal Ram Size
40KB
# I/os (max)
106
Number Of Timers - General Purpose
5
Operating Supply Voltage (typ)
3.3V
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
3V
On-chip Adc
8-chx10-bit
On-chip Dac
2-chx8-bit
Instruction Set Architecture
CISC
Operating Temp Range
-20C to 75C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
144
Package Type
TQFP
Lead Free Status / Rohs Status
Not Compliant

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8.10.5
Port A has a built-in input pull-up MOS that can be controlled by software. This input pull-up
MOS can be used in any operating mode, and can be specified as on or off on a bit-by-bit basis.
[Legend]
n = 7 to 0
The input pull-up MOS is in the off state after a reset and in hardware standby mode. The prior
state is retained in software standby mode.
Table 8.6 summarizes the input pull-up MOS states.
Table 8.6
[Legend]
Off:
On/Off: On when PADDR = 0 and PAODR = 1; otherwise off.
SSE
C/A
CKE1
PA0DDR
Pin function
PAnDDR
PAnODR
PAn pull-up MOS
Reset
Off
Always off.
Input Pull-Up MOS
Port A Input Pull-Up MOS States
Hardware Standby
Mode
Off
/EVENT0 input pin
KIN8 input pin
PA0 input pin
0
ON
1
0
0
Software Standby
Mode
On/Off
PA0 output pin
OFF
1
0
Rev. 3.00, 03/04, page 231 of 830
In Other Operations
On/Off
SSE0I
OFF
1
1
1
1

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