UPD70F3738GF-GAS-AX Renesas Electronics America, UPD70F3738GF-GAS-AX Datasheet - Page 929

• Manufacturer Part Number: UPD70F3738GF-GAS-AX
• Description: MCU 32BIT V850ES/JX3-L 100-LQFP
• Manufacturer: Renesas Electronics America
• Series: V850ES/Jx3-Lr

Specifications of UPD70F3738GF-GAS-AX

• Core Processor: RISC
• Core Size: 32-Bit
• Speed: 20MHz
• Connectivity: CSI, EBI/EMI, I²C, UART/USART
• Peripherals: DMA, LVD, PWM, WDT
• Number Of I /o: 84
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 2.2 V ~ 3.6 V
• Data Converters: A/D 12x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: *
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

The following table shows the features of the two on-chip debugging methods.
Notes 1. This is a function which reads out memory contents during program execution.
Debug interface pins
Allocating user resources
Hardware break function
Software break
function
Real-time RAM monitor function
Dynamic memory modification (DMM)
function
Mask function
ROM security function
Hardware used
Trace function
Debug interrupt interface function
(DBINT)
Note 2
2. This is a function which rewrites RAM contents during program execution.
Internal ROM area
Internal RAM area
Note 1
Table 31-1. Overview of On-Chip Debugging
CHAPTER 31 ON-CHIP DEBUG FUNCTION
DRST, DCK, DMS, DDI, DDO
Not required
2 points
4 points
2000 points
Available
Available
Reset, NMI, INTWDT2, HLDRQ,
WAIT
10-byte ID code authentication
MINICUBE, etc.
Not supported.
Not supported.
User’s Manual U18953EJ5V0UD
Debugging Using DCU
• When UARTA0 is used
• When CSIB0 is used
• When CSIB3 is used
Required
2 points
4 points
2000 points
Available
Available
RESET pin
10-byte ID code authentication
MINICUBE2, etc.
Not supported.
Not supported.
RXD0, TXD0
SIB0, SOB0, SCKB0, HS (PCM0)
SIB3, SOB3, SCKB3, HS (PCM0)
Debugging Without Using DCU
927