UPD70F3738GF-GAS-AX Renesas Electronics America, UPD70F3738GF-GAS-AX Datasheet - Page 946

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UPD70F3738GF-GAS-AX

Manufacturer Part Number
UPD70F3738GF-GAS-AX
Description
MCU 32BIT V850ES/JX3-L 100-LQFP
Manufacturer
Renesas Electronics America
Series
V850ES/Jx3-Lr
Datasheet

Specifications of UPD70F3738GF-GAS-AX

Core Processor
RISC
Core Size
32-Bit
Speed
20MHz
Connectivity
CSI, EBI/EMI, I²C, UART/USART
Peripherals
DMA, LVD, PWM, WDT
Number Of I /o
84
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
2.2 V ~ 3.6 V
Data Converters
A/D 12x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
*
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
UPD70F3738GF-GAS-AX
Manufacturer:
Renesas Electronics America
Quantity:
10 000
31.2.4 Cautions
944
(1) Handling of device that was used for debugging
(2) When breaks cannot be executed
(3) When pseudo real-time RAM monitor (RRM) function and DMM function do not operate
(4) Standby release with pseudo RRM and DMM functions enabled
(5) Writing to peripheral I/O registers that require a specific sequence, using DMM function
(6) Flash self programming
(7) On-chip debugging can be used when the supply voltage (V
• Interrupts are disabled (DI)
• Interrupts issued for the serial interface, which is used for communication between MINICUBE2 and the
• Standby mode is entered while standby release by a maskable interrupt is prohibited
• Mode for communication between MINICUBE2 and the target device is UARTA0, and the main clock has
• Mode for communication between MINICUBE2 and the target device is UARTA0, and a clock different from
• Mode for communication between MINICUBE2 and the target device is CSIB0 or CSIB3
• Mode for communication between MINICUBE2 and the target device is UARTA0, and the main clock has
• Interrupts are disabled (DI)
• Interrupts issued for the serial interface, which is used for communication between MINICUBE2 and the
• Standby mode is entered while standby release by a maskable interrupt is prohibited
• Mode for communication between MINICUBE2 and the target device is UARTA0, and the main clock has
Do not mount a device that was used for debugging on a mass-produced product, because the flash memory
was rewritten during debugging and the number of rewrites of the flash memory cannot be guaranteed.
Moreover, do not embed the debug monitor program into mass-produced products.
Forced breaks cannot be executed if one of the following conditions is satisfied.
The pseudo RRM function and DMM function do not operate if one of the following conditions is satisfied.
The standby mode is released by the pseudo RRM function and DMM function if one of the following
conditions is satisfied.
Peripheral I/O registers that require a specific sequence cannot be written by using the DMM function.
If the space where the debug monitor program is allocated is rewritten by flash self programming, the
debugger can no longer operate normally.
at less than 2.7 V.
target device, are masked
been stopped
target device, are masked
been stopped
the one specified in the debugger is used for communication
been supplied.
CHAPTER 31 ON-CHIP DEBUG FUNCTION
User’s Manual U18953EJ5V0UD
DD
) is in a range of 2.7 to 3.6 V. It cannot be used

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