MMC2114CFCAG33 Freescale Semiconductor, MMC2114CFCAG33 Datasheet - Page 615

• Manufacturer Part Number: MMC2114CFCAG33
• Description: IC MCU 32BIT 33MHZ 144-LQFP
• Manufacturer: Freescale Semiconductor
• Series: MCorer

Specifications of MMC2114CFCAG33

• Core Processor: M210
• Core Size: 32-Bit
• Speed: 33MHz
• Connectivity: EBI/EMI, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 67
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 3.6 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 144-LQFP
• Processor Series: MMC2114
• Core: M-CORE
• Data Bus Width: 32 bit
• Data Ram Size: 32 KB
• Interface Type: SCI/SPI
• Maximum Clock Frequency: 33 MHz
• Number Of Programmable I/os: 104
• Number Of Timers: 2
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8-ch x 10-bit
• Controller Family/series: MCORE
• No. Of I/o's: 104
• Ram Memory Size: 32KB
• Cpu Speed: 33MHz
• No. Of Timers: 2
• Embedded Interface Type: SCI, SPI
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

23.6 Electrostatic Discharge (ESD) Protection
MMC2114 • MMC2113 • MMC2112 — Rev. 1.0
MOTOROLA
ESD target for human body model
ESD target for machine model
HBM circuit description
MM circuit description
Number of pulses per pin (HBM)
Number of pulses per pin (MM)
Interval of pulses
1. All ESD testing is in conformity with CDF-AEC-Q100 Stress Test Qualification for Automotive
2. A device will be defined as a failure if after exposure to ESD pulses the device no longer
Positive pulses
Negative pulses
Positive pulses
Negative pulses
Freescale Semiconductor, Inc.
Grade Integrated Circuits.
meets the device specification requirements. Complete DC parametric and functional testing
shall be performed per applicable device specification at room temperature followed by hot
temperature, unless specified otherwise in the device specification.
For More Information On This Product,
Preliminary Electrical Specifications
Go to: www.freescale.com
Table 23-3. ESD Protection Characteristics
Parameter
(1)

Ã
(2)
Electrostatic Discharge (ESD) Protection
Preliminary Electrical Specifications
Symbol
R
R
HBM
MM
Series
Series
—
—
—
C
C
Advance Information
Value
2000
1500
200
100
200
0
1
1
3
3
1
Units
Sec
pF
pF
—
—
W
W
V
V
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