MMC2114CFCAG33 Freescale Semiconductor, MMC2114CFCAG33 Datasheet - Page 97

• Manufacturer Part Number: MMC2114CFCAG33
• Description: IC MCU 32BIT 33MHZ 144-LQFP
• Manufacturer: Freescale Semiconductor
• Series: MCorer

Specifications of MMC2114CFCAG33

• Core Processor: M210
• Core Size: 32-Bit
• Speed: 33MHz
• Connectivity: EBI/EMI, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 67
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 3.6 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 144-LQFP
• Processor Series: MMC2114
• Core: M-CORE
• Data Bus Width: 32 bit
• Data Ram Size: 32 KB
• Interface Type: SCI/SPI
• Maximum Clock Frequency: 33 MHz
• Number Of Programmable I/os: 104
• Number Of Timers: 2
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8-ch x 10-bit
• Controller Family/series: MCORE
• No. Of I/o's: 104
• Ram Memory Size: 32KB
• Cpu Speed: 33MHz
• No. Of Timers: 2
• Embedded Interface Type: SCI, SPI
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

3.2 Introduction
MMC2114 • MMC2113 • MMC2112 — Rev. 1.0
MOTOROLA
NOTE:
The MMC2114, MMC2113, and MMC2112 are available in three
packages:
The optional group of pins includes:
The optional pins are either all present or none of them are present.
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Freescale Semiconductor, Inc.
For More Information On This Product,
100-pin Joint-Electron Device Engineering Council (JEDEC) low-
profile quad flat pack (LQFP) — The 100-pin device is a minimum
pin set for single-chip mode implementation.
144-pin JEDEC LQFP — The 144-pin implementation includes 44
optional pins as a bond-out option to:
– Accommodate an expanded set of features
– Allow expansion of the number of general-purpose
– Utilize off-chip memory
– Provide enhanced support for development purposes
196-pin molded array process (MAP) ball grid array (BGA) — The
196-pin implementation includes:
– Single-chip operation with extra general-purpose input/output
– Expanded master mode for interfacing to external memories
– Emulation mode for development and debug
23 address output lines
Four chip selects
Two emulation chip selects
Four byte/write enables
Read/write (R/W) signal
Output enable signal
Three transfer code signals
Six power/ground pins
input/output (I/O)
Go to: www.freescale.com
Signal Description
Advance Information
Signal Description
Introduction
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