MMC2114CFCAG33 Freescale Semiconductor, MMC2114CFCAG33 Datasheet - Page 639

• Manufacturer Part Number: MMC2114CFCAG33
• Description: IC MCU 32BIT 33MHZ 144-LQFP
• Manufacturer: Freescale Semiconductor
• Series: MCorer

Specifications of MMC2114CFCAG33

• Core Processor: M210
• Core Size: 32-Bit
• Speed: 33MHz
• Connectivity: EBI/EMI, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 67
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 3.6 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 144-LQFP
• Processor Series: MMC2114
• Core: M-CORE
• Data Bus Width: 32 bit
• Data Ram Size: 32 KB
• Interface Type: SCI/SPI
• Maximum Clock Frequency: 33 MHz
• Number Of Programmable I/os: 104
• Number Of Timers: 2
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8-ch x 10-bit
• Controller Family/series: MCORE
• No. Of I/o's: 104
• Ram Memory Size: 32KB
• Cpu Speed: 33MHz
• No. Of Timers: 2
• Embedded Interface Type: SCI, SPI
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

24.1 Contents
24.2 Introduction
MMC2114 • MMC2113 • MMC2112 — Rev. 1.0
MOTOROLA
Advance Information — MMC2114, MMC2113, and MMC2112
24.2
24.3
24.4
24.5
24.6
24.7
24.8
24.9
The MMC2114, MMC2113, and MMC2112 are available in three types
of packages:
1. 100-pin low-profile quad flat pack (LQFP) version supporting
2. 144-pin LQFP version supporting:
3. 196-ball mold array process ball grid array (MAPBGA) version
Freescale Semiconductor, Inc.
For More Information On This Product,
single-chip mode of operation
– Single-chip operation with extra general-purpose input/output
– Expanded master mode for interfacing to external memories
– Emulation mode for development and debug
supporting:
– Single-chip operation with extra general-purpose input/output
– Expanded master mode for interfacing to external memories
– Emulation mode for development and debug
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 639
Bond Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 640
Package Information for the 144-Pin LQFP . . . . . . . . . . . . . . 641
Package Information for the 100-Pin LQFP . . . . . . . . . . . . . . 641
Package Information for the 196-Ball MAPBGA . . . . . . . . . . . 642
144-Pin LQFP Mechanical Drawing . . . . . . . . . . . . . . . . . . . . 643
100-Pin LQFP Mechanical Drawing . . . . . . . . . . . . . . . . . . . . 644
196-Ball MAPBGA Mechanical Drawing. . . . . . . . . . . . . . . . . 645
Section 24. Mechanical Specifications
Go to: www.freescale.com
Mechanical Specifications
Advance Information
639