EP2AGX65DF29C6N Altera, EP2AGX65DF29C6N Datasheet - Page 145

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EP2AGX65DF29C6N

Manufacturer Part Number
EP2AGX65DF29C6N
Description
IC ARRIA II GX FPGA 65K 780FBGA
Manufacturer
Altera
Series
Arria II GXr

Specifications of EP2AGX65DF29C6N

Number Of Logic Elements/cells
60214
Number Of Labs/clbs
2530
Total Ram Bits
5246
Number Of I /o
364
Voltage - Supply
0.87 V ~ 0.93 V
Mounting Type
Surface Mount
Operating Temperature
0°C ~ 85°C
Package / Case
780-FBGA
Family Name
Arria® II GX
Number Of Logic Blocks/elements
63250
# I/os (max)
364
Frequency (max)
400MHz
Operating Supply Voltage (typ)
900mV
Logic Cells
63250
Ram Bits
5557452.8
Operating Supply Voltage (min)
0.87V
Operating Supply Voltage (max)
0.93V
Operating Temp Range
0C to 85C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
780
Package Type
FC-FBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Number Of Gates
-
Lead Free Status / Rohs Status
Compliant

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Chapter 6: I/O Features in Arria II GX Devices
Arria II GX OCT Support
Table 6–5. Arria II GX MultiVolt I/O Support
Arria II GX OCT Support
© July 2010 Altera Corporation
Notes to
(1) The pin current may be slightly higher than the default value. You must verify that the driving device’s V
(2) Each I/O bank of an Arria II GX Device has its own VCCIO pins and supports only one V
(3) Altera recommends using an external clamp diode on the column I/O pins when the input signal is 3.0 V or 3.3 V.
VCCIO (V)
do not violate the applicable Arria II GX V
I/O standard is not supported when V
output operations are only supported when V
1.2
1.5
1.8
2.5
3.0
3.3
(2)
Table
6–5:
1
1.2
v
Arria II GX devices feature R
termination capabilities. OCT maintains signal quality, saves board space, and
reduces external component costs.
Arria II GX devices support R
differential termination for differential LVDS I/O standards. Arria II GX devices
support OCT in all user I/O banks by selecting one of the OCT I/O standards.
Arria II GX devices support R
standards if they use the same V
each I/O in an I/O bank to support R
You cannot configure both R
I/O buffer.
A pair of RUP and RDN pins are available in a given I/O bank for series calibrated
termination. RUP and RDN pins share the same V
I/O bank where they are located. RUP and RDN pins are dual-purpose I/Os, and
function as regular I/Os if you do not use the calibration circuit. When used for
calibration, RUP and RDN pins are connected to V
external 25- ±1% or 50- ±1% resistor for a R
respectively.
On-Chip Series Termination without Calibration
Arria II GX devices support driver-impedance matching to provide the I/O driver
with controlled output impedance that closely matches the impedance of the
transmission line. As a result, you can significantly reduce reflections. Arria II GX
devices support R
The R
typical R
1.5
v
v
S
shown in
Input Signal (V)
S
1.8
v
v
values are 25  and 50  .
CCIO
IL
is 3.0 V. The LVDS input operations are supported when V
maximum and V
CCIO
Figure 6–3
2.5
v
v
v
S
(Note 1)
OCT for single-ended I/O standards.
is 2.5 V.
v
v
v
3.0
IH
(3)
(3)
(3)
is the intrinsic impedance of output transistors. The
minimum voltage specifications.
S
S
S
S
OCT and programmable current strength for the same
OCT to provide I/O impedance matching and
OCT with or without calibration, and on-chip
OCT in the same I/O bank with different I/O
v
v
CCIO
v
3.3
(3)
(3)
(3)
supply voltage. You can independently configure
S
OCT or programmable current strength.
1.2
v
S
CCIO
OCT value of 25  or 50  ,
CCIO
CCIO
, either 1.2, 1.5, 1.8, 2.5, 3.0, or 3.3 V. The LVDS
1.5
v
or GND, respectively, through an
and GND, respectively, with the
Output Signal (V)
CCIO
OL
Arria II GX Device Handbook, Volume 1
maximum and V
is 1.2, 1.5, 1.8, or 2.5 V. The LVDS
1.8
v
2.5
v
OH
minimum voltages
3.0
v
3.3
v
6–11

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