EP2AGX65DF29C6N Altera, EP2AGX65DF29C6N Datasheet - Page 25

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EP2AGX65DF29C6N

Manufacturer Part Number
EP2AGX65DF29C6N
Description
IC ARRIA II GX FPGA 65K 780FBGA
Manufacturer
Altera
Series
Arria II GXr

Specifications of EP2AGX65DF29C6N

Number Of Logic Elements/cells
60214
Number Of Labs/clbs
2530
Total Ram Bits
5246
Number Of I /o
364
Voltage - Supply
0.87 V ~ 0.93 V
Mounting Type
Surface Mount
Operating Temperature
0°C ~ 85°C
Package / Case
780-FBGA
Family Name
Arria® II GX
Number Of Logic Blocks/elements
63250
# I/os (max)
364
Frequency (max)
400MHz
Operating Supply Voltage (typ)
900mV
Logic Cells
63250
Ram Bits
5557452.8
Operating Supply Voltage (min)
0.87V
Operating Supply Voltage (max)
0.93V
Operating Temp Range
0C to 85C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
780
Package Type
FC-FBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Number Of Gates
-
Lead Free Status / Rohs Status
Compliant

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EP2AGX65DF29C6N@@@@@
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Chapter 1: Arria II GX Device Family Overview
Reference and Ordering Information
SEU Mitigation
JTAG Boundary Scan Testing
Reference and Ordering Information
© July 2010 Altera Corporation
Figure 1–2
Figure 1–2. Packaging Ordering Information Arria II GX Devices
Transceiver Count
F: FineLine BGA (FBGA)
U: Micro BGA (UFBGA)
C: 4
D: 8
E: 12
F:16
EP2AGX
125, 190, 260
Offers built-in error detection circuitry to detect data corruption due to soft errors
in the configuration random access memory (CRAM) cells
Allows all CRAM contents to be read and verified to match a
configuration-computed cyclic redundancy check (CRC) value
You can identify and read out the bit location and the type of soft error through the
JTAG or the core interface
Supports JTAG IEEE Std. 1149.1 and IEEE Std. 1149.6 specifications
IEEE Std. 1149.6 supports high-speed serial interface (HSSI) transceivers and
performs boundary scan on alternating current (AC)-coupled transceiver channels
Boundary-scan test (BST) architecture offers the capability to test pin connections
without using physical test probes and capture functional data while a device is
operating normally
Device Density
Package Type
Family S i g n a t u r e
45, 65, 95
describes the ordering codes for Arria II GX devices.
EP2AGX
45
C
F
Ball Array Dimension
Corresponds to pin count
17 = 358 pins
25 = 572 pins
29 = 780 pins
35 = 1152 pins
17
C
4
N
Indicates specific device shipment method
ES: Engineering sample
N: Lead-free devices
Optional Suffix
3, 4, 5, or 6, with 3 being the fastest
C: Commercial temperature (t
I: Industrial temperature (t
Arria II GX Device Handbook, Volume 1
Speed Grade
Operating Temperature
J
= -40°C to 100°C)
J
= 0°C to 85°C)
1–11

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