EP2AGX65DF29C6N Altera, EP2AGX65DF29C6N Datasheet - Page 185

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EP2AGX65DF29C6N

Manufacturer Part Number
EP2AGX65DF29C6N
Description
IC ARRIA II GX FPGA 65K 780FBGA
Manufacturer
Altera
Series
Arria II GXr

Specifications of EP2AGX65DF29C6N

Number Of Logic Elements/cells
60214
Number Of Labs/clbs
2530
Total Ram Bits
5246
Number Of I /o
364
Voltage - Supply
0.87 V ~ 0.93 V
Mounting Type
Surface Mount
Operating Temperature
0°C ~ 85°C
Package / Case
780-FBGA
Family Name
Arria® II GX
Number Of Logic Blocks/elements
63250
# I/os (max)
364
Frequency (max)
400MHz
Operating Supply Voltage (typ)
900mV
Logic Cells
63250
Ram Bits
5557452.8
Operating Supply Voltage (min)
0.87V
Operating Supply Voltage (max)
0.93V
Operating Temp Range
0C to 85C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
780
Package Type
FC-FBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Number Of Gates
-
Lead Free Status / Rohs Status
Compliant

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© July 2010
AIIGX51008-3.0
Altera Corporation
This chapter describes the high-speed differential I/O features and resources as well
as the functionality of the serializer/deserializer (SERDES) and dynamic phase
alignment (DPA) circuitry in Arria
in Arria II GX devices allows for high-speed LVDS interface on the top, bottom, and
right sides of the device. The left side of the device is occupied by high-speed
transceiver blocks. Dedicated SERDES and DPA circuitry are implemented on the
right side of the device to further enhance LVDS interface performance in the device.
This chapter contains the following sections:
Arria II GX devices have the following dedicated circuitry for high-speed differential
I/O support:
Arria II GX devices support the following differential I/O standards:
“LVDS Channels” on page 8–2
“LVDS SERDES and DPA Block Diagram” on page 8–5
“Differential Transmitter” on page 8–7
“Differential Receiver” on page 8–9
“Programmable Pre-Emphasis and Programmable V
“Differential I/O Termination” on page 8–18
“PLLs” on page 8–18
“LVDS and DPA Clock Networks” on page 8–19
“Source-Synchronous Timing Budget” on page 8–20
“Differential Pin Placement Guidelines” on page 8–23
“Setting Up an LVDS Transmitter or Receiver Channel” on page 8–33
Differential I/O buffer
Transmitter serializer
Receiver deserializer
Data realignment
DPA
Synchronizer (FIFO buffer)
Phase-locked loops (PLLs)
LVDS
mini-LVDS
Reduced swing differential signaling (RSDS)
Low-voltage positive emitter-coupled logic (LVPECL)
Bus LVDS (BLVDS)
8. High-Speed Differential I/O Interfaces
®
II GX devices. The new modular I/O architecture
and DPA in Arria II GX Devices
OD
Arria II GX Device Handbook, Volume 1
.” on page 8–17

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