R5F213J6CNNP#U0 Renesas Electronics America, R5F213J6CNNP#U0 Datasheet - Page 657

• Manufacturer Part Number: R5F213J6CNNP#U0
• Description: MCU 1KB FLASH 32K ROM 36-QFN
• Manufacturer: Renesas Electronics America
• Series: R8C/3x/3JCr

Specifications of R5F213J6CNNP#U0

• Core Processor: R8C
• Core Size: 16/32-Bit
• Speed: 20MHz
• Connectivity: I²C, LIN, SIO, SSU, UART/USART
• Peripherals: POR, PWM, Voltage Detect, WDT
• Number Of I /o: 31
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• Ram Size: 2.5K x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 5.5 V
• Data Converters: A/D 10x10b, D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 85°C
• Package / Case: 36-WQFN Exposed Pad, 36-HWQFN
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

R8C/3JC Group
REJ09B0602-0100 Rev.1.00
May 12, 2010
Figure 31.6
31.4.9
When the program ROM area is specified while a program or block erase operation to the data flash, array data
can be read. This eliminates the need for writing software commands. Access time is the same as for normal
read operations.
Any other block of the data flash cannot read during a program or block erase operation to the data flash.
Figure 31.6 shows the BGO Function.
Data flash
Program ROM
BGO (BackGround Operation) Function
BGO Function
Read
Read
Erase/program
Read
Read
Time
31. Flash Memory
Page 626 of 715