HD6417727F100CV Renesas Electronics America, HD6417727F100CV Datasheet - Page 361
HD6417727F100CV
Manufacturer Part Number
HD6417727F100CV
Description
SH3-DSP, LEAD FREE
Manufacturer
Renesas Electronics America
Series
SuperH® SH7700r
Datasheet
1.HD6417727BP100CV.pdf
(1098 pages)
Specifications of HD6417727F100CV
Core Processor
SH-3 DSP
Core Size
32-Bit
Speed
100MHz
Connectivity
FIFO, SCI, SIO, SmartCard, USB
Peripherals
DMA, LCD, POR, WDT
Number Of I /o
104
Program Memory Type
ROMless
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
1.6 V ~ 2.05 V
Data Converters
A/D 6x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
240-QFP Exposed Pad, 240-eQFP, 240-HQFP
Cpu Family
SuperH
Device Core Size
32b
Frequency (max)
100MHz
Interface Type
SCI/USB
Program Memory Size
Not Required
Total Internal Ram Size
16KB
# I/os (max)
104
Number Of Timers - General Purpose
4
Operating Supply Voltage (typ)
1.8/3.3V
Operating Supply Voltage (max)
2.05/3.6V
Operating Supply Voltage (min)
1.6/2.6V
On-chip Adc
6-chx10-bit
On-chip Dac
2-chx8-bit
Instruction Set Architecture
RISC
Operating Temp Range
-20C to 75C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
240
Package Type
HQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Lead Free Status / Rohs Status
Compliant
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12.2.5
The individual memory control register (MCR) is a 16-bit read/write register that specifies RAS
and CAS timing and burst control for synchronous DRAM (areas 2 and 3), specifies address
multiplexing, and controls refresh. This enables direct connection of synchronous DRAM without
external circuits.
The MCR is initialized to H'0000 by power-on resets, but is not initialized by manual resets or
standby mode. The bits TPC1 to TPC0, RCD1 to RCD0, TRWL1 to TRWL0, TRAS1 to TRAS0,
AMX3 to AMX0, and are written to at the initialization after a power-on reset and are not then
modified again. When RFSH and RMODE are written to, write the same values to the other bits.
When using synchronous DRAM, do not access areas 2 and 3 until this register is initialized.
Bits 15 and 14—RAS Precharge Time (TPC1, TPC0): These bits set the minimum number of
cycles until output of the next bank-active command after precharge, when the synchronous
DRAM interface is selected for external memory. However, the number of cycles inserted
immediately after the precharge all banks (PALL) command is issued when performing auto-
refresh is one fewer than the number of cycles during normal operation.
Bit 15:
TPC1
0
1
Note: * Immediately after the precharge all banks (PALL) command is issued when performing
Initial value:
R/W: R/W
auto-refresh.
Bit:
Individual Memory Control Register (MCR)
Bit 14:
TPC0
0
1
0
1
TPC1 TPC0 RCD1 RCD0 TRWL
15
0
R/W
14
0
Description
Normal Operation
1 cycle
2 cycles
3 cycles
4 cycles
R/W
13
0
R/W
12
0
(Initial value) 0 cycle
R/W
11
1
0
TRWL
R/W
10
0
0
TRAS
Immediately After
Precharge Command*
1 cycle
2 cycles
3 cycles
R/W
9
1
0
TRAS
R/W
8
0
0
(Initial value)
Rev.6.00 Mar. 27, 2009 Page 303 of 1036
R/W
—
7
0
Section 12 Bus State Controller (BSC)
AMX3 AMX2 AMX1 AMX0 RFSH RMO
R/W
6
0
R/W
5
0
R/W
4
0
Immediately After
Self-refresh
2 cycles
5 cycles
8 cycles
11 cycles
R/W
3
0
REJ09B0254-0600
R/W
2
0
(Initial value)
R/W
DE
1
0
R/W
—
0
0
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