MMCCMB2107 Freescale, MMCCMB2107 Datasheet - Page 587

• Manufacturer Part Number: MMCCMB2107
• Manufacturer: Freescale

Specifications of MMCCMB2107

• Lead Free Status / RoHS Status: Not Compliant

22.4 Thermal Characteristics
22.5 Power Dissipation
22.6 Electrostatic Discharge (ESD) Protection
MMC2107 – Rev. 2.0
MOTOROLA
The average chip-junction temperature (T
where:
For most applications, P
P
Solving equations 1 and 2 for K gives:
where K is a constant pertaining to the particular part. K can be determined from equation (3)
by measuring P
T
J
D
can be obtained by solving equations (1) and (2) iteratively for any value of T
T
P
P
P
and T
JA
A
D
INT
I/O
= Ambient temperature, C
= Package thermal resistance, junction-to-ambient, C/W
= P
= I
= Power dissipation on input and output pins — user determined
J
(if P
DD
INT
I/O
D
V
(at equilibrium) for a known T
is neglected) is:
P
DD
I/O
, watts — chip internal power
ESD target for human body model
ESD target for machine model
HBM circuit description
MM circuit description
Thermal Resistance
I/O
1. All ESD testing is in conformity with CDF-AEC-Q100 Stress Test Qualification for
K = P
Plastic 100-pin LQFP surface mount
Plastic 144-pin LQFP surface mount
Freescale Semiconductor, Inc.
Automotive Grade Integrated Circuits.
For More Information On This Product,
P
D
INT
P
D
T
and can be neglected. An approximate relationship between
(T
J
= K
Go to: www.freescale.com
Table 22-3. ESD Protection Characteristics
= T
A
Electrical Specifications
+ 273 C) +
Parameter
A
Table 22-2. Thermal Characteristics
Parameter
(T
+ P
J
) in C can be obtained from:
J
+ 273 C)
D
x
A
(1)
. Using this value of K, the values of P
JA
JA
P
D
2
Symbol
Symbol
R
R
HBM
MM
Series
Series
C
C
JA
Thermal Characteristics
Electrical Specifications
Value
Value
2000
1500
200
100
200
43.5
46.1
A
0
.
Technical Data
D
Units
Unit
(1)
(2)
(3)
and
C/W
pF
pF
W
W
V
V
587