MMCCMB2107 Freescale, MMCCMB2107 Datasheet - Page 610

• Manufacturer Part Number: MMCCMB2107
• Manufacturer: Freescale

Specifications of MMCCMB2107

• Lead Free Status / RoHS Status: Not Compliant

Mechanical Specifications
23.3 Bond Pins
Technical Data
610
The MMC2107 die has a total of 144 bond pads. Of these, the pads that
are not bonded out in the 100-pin package are distributed around the
circumference of the die. This optional group of pins includes:
For more detailed information, see
Freescale Semiconductor, Inc.
For More Information On This Product,
A[22:0]
R/W
EB[3:0]
CSE[1:0]
TC[2:0]
OE
CS[3:0]
3 x V
3 x V
DD
SS
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Mechanical Specifications
Section 4. Signal
MMC2107 – Rev. 2.0
Description.
MOTOROLA