DF2148BTE20 Renesas Electronics America, DF2148BTE20 Datasheet - Page 54

IC H8S MCU FLASH 128K 100-QFP

DF2148BTE20

Manufacturer Part Number
DF2148BTE20
Description
IC H8S MCU FLASH 128K 100-QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2100r
Datasheets

Specifications of DF2148BTE20

Core Processor
H8S/2000
Core Size
16-Bit
Speed
20MHz
Connectivity
I²C, IrDA, SCI, X-Bus
Peripherals
PWM, WDT
Number Of I /o
74
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Other names
HD64F2148BTE20
HD64F2148BTE20

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF2148BTE20V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Section 20 D/A Converter
Table 20.1
Table 20.2
Section 21 A/D Converter
Table 21.1
Table 21.2
Table 21.3
Section 23 ROM
Table 23.1
Table 23.2
Table 23.3
Table 23.4
Table 23.5
Table 23.6
Section 24 Clock Pulse Generator
Table 24.1
Table 24.2
Table 24.3
Table 24.4
Table 24.5
Section 25 Power-Down Modes
Table 25.1
Table 25.2
Section 27 Electrical Characteristics
Table 27.1
Table 27.2
Table 27.2
Table 27.2
Table 27.3
Table 27.4
Table 27.5
Table 27.6
Table 27.7
Table 27.7
Table 27.8
Rev. 3.00 Mar 21, 2006 page lii of liv
Pin Configuration ................................................................................................... 580
D/A Channel Enable............................................................................................... 582
Pin Configuration ................................................................................................... 587
Analog Input Channels and Corresponding ADDR Registers................................ 588
A/D Conversion Time (Single Mode) .................................................................... 595
Differences between Boot Mode and User Program Mode.................................... 605
Pin Configuration ................................................................................................... 611
Operating Modes and ROM ................................................................................... 617
On-Board Programming Mode Settings................................................................. 618
Boot Mode Operation............................................................................................. 620
System Clock Frequencies for which Automatic Adjustment of LSI Bit Rate
Is Possible............................................................................................................... 621
Damping Resistance Values ................................................................................... 634
Crystal Resonator Parameters ................................................................................ 635
External Clock Input Conditions ............................................................................ 636
External Clock Output Stabilization Delay Time................................................... 637
Subclock Input Conditions ..................................................................................... 638
Operating Frequency and Wait Time ..................................................................... 643
LSI Internal States in Each Mode........................................................................... 648
Absolute Maximum Ratings................................................................................... 701
DC Characteristics (1) ............................................................................................ 702
DC Characteristics (2) ............................................................................................ 705
DC Characteristics (3) When LPC Function Is Used ............................................. 707
Permissible Output Currents .................................................................................. 708
Bus Drive Characteristics ....................................................................................... 709
Clock Timing ......................................................................................................... 711
Control Signal Timing............................................................................................ 712
Bus Timing (1) (Normal Mode) ............................................................................. 713
Bus Timing (2) (Advanced Mode) ......................................................................... 714
Timing of On-Chip Peripheral Modules (1) ........................................................... 715

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