UPD70F3771GF-GAT-AX Renesas Electronics America, UPD70F3771GF-GAT-AX Datasheet - Page 1447

• Manufacturer Part Number: UPD70F3771GF-GAT-AX
• Description: MCU 32BIT V850ES/JX3-H 128-LQFP
• Manufacturer: Renesas Electronics America
• Series: V850ES/Jx3-Hr

Specifications of UPD70F3771GF-GAT-AX

• Core Processor: RISC
• Core Size: 32-Bit
• Speed: 48MHz
• Connectivity: CAN, CSI, EBI/EMI, I²C, UART/USART, USB
• Peripherals: DMA, LVD, PWM, WDT
• Number Of I /o: 96
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 40K x 8
• Voltage - Supply (vcc/vdd): 2.85 V ~ 3.6 V
• Data Converters: A/D 12x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: *
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

V850ES/JG3-H, V850ES/JH3-H
sales representative.
Note
Caution Do not use different soldering methods together (except for partial heating).
Remarks 1. Products with –AX at the end of the part number are lead-free products.
R01UH0042EJ0400 Rev.4.00
Sep 30, 2010
Infrared reflow
Partial heating
Soldering Method
These products should be soldered and mounted under the following recommended conditions.
For soldering methods and conditions other than those recommended below, please contact a Renesas Electronics
For technical information, see the following website.
Semiconductor Device Mount Manual (http://www2.renesas.com/pkg/en/mount/index.html)
Remark Evaluation of the soldering conditions for the (A) standard products is incomplete because these products
μ
μ
μ
μ
PD70F3761GC-UEU-AX: 100-pin plastic LQFP (fine pitch) (14 × 14 mm)
PD70F3762GC-UEU-AX: 100-pin plastic LQFP (fine pitch) (14 × 14 mm)
PD70F3770GC-UEU-AX: 100-pin plastic LQFP (fine pitch) (14 × 14 mm)
PD70F3760GC-UEU-AX: 100-pin plastic LQFP (fine pitch) (14 × 14 mm)
After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.
2. For soldering methods and conditions other than those recommended, please contact a Renesas
are under development.
Electronics sales representative.
Package peak temperature: 260°C, Time: 60 seconds max. (at 220°C or higher),
Count: 3 times or less, Exposure limit: 7 days
20 to 72 hours)
Pin temperature: 350°C max., Time: 3 seconds max. (per pin row)
CHAPTER 35 RECOMMENDED SOLDERING CONDITIONS
Table 35-1. Surface Mounting Type Soldering Conditions (1/2)
Soldering Conditions
CHAPTER 35 RECOMMENDED SOLDERING CONDITIONS
Note
(after that, prebake at 125°C for
IR60-207-3
Condition Symbol
Recommended
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