LFEC3E-3QN208I Lattice, LFEC3E-3QN208I Datasheet - Page 3
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LFEC3E-3QN208I
Manufacturer Part Number
LFEC3E-3QN208I
Description
IC FPGA 3KLUTS 208PQFP
Manufacturer
Lattice
Series
EC3r
Datasheets
1.LFEC3E-5TN144C.pdf
(163 pages)
2.LFE3-35EA-8FN672I.pdf
(21 pages)
3.LFEC3E-3QN208I.pdf
(478 pages)
Specifications of LFEC3E-3QN208I
Number Of Logic Elements/cells
3100
Number Of Labs/clbs
-
Total Ram Bits
56320
Number Of I /o
145
Number Of Gates
-
Voltage - Supply
1.14 V ~ 1.26 V
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 100°C
Package / Case
208-BFQFP
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
Q6377645
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LFEC3E-3QN208I
Manufacturer:
Lattice Semiconductor Corporation
Quantity:
10 000
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Lattice Semiconductor
DC and Switching Characteristics
Pinout Information
Density Shifting ................................................................................................................................................ 2-33
Absolute Maximum Ratings ............................................................................................................................... 3-1
Recommended Operating Conditions ................................................................................................................ 3-1
Hot Socketing Specifications.............................................................................................................................. 3-1
DC Electrical Characteristics.............................................................................................................................. 3-2
Supply Current (Standby)................................................................................................................................... 3-3
Initialization Supply Current ............................................................................................................................... 3-4
sysIO Recommended Operating Conditions...................................................................................................... 3-5
sysIO Single-Ended DC Electrical Characteristics............................................................................................. 3-6
sysIO Differential Electrical Characteristics ....................................................................................................... 3-7
Typical Building Block Function Performance.................................................................................................. 3-12
Derating Timing Tables .................................................................................................................................... 3-13
LatticeECP/EC External Switching Characteristics.......................................................................................... 3-14
LatticeECP/EC Internal Switching Characteristics ........................................................................................... 3-16
Timing Diagrams .............................................................................................................................................. 3-18
LatticeECP/EC Family Timing Adders
sysCLOCK PLL Timing .................................................................................................................................... 3-23
LatticeECP/EC sysCONFIG Port Timing Specifications .................................................................................. 3-24
JTAG Port Timing Specifications ..................................................................................................................... 3-29
Switching Test Conditions................................................................................................................................ 3-30
Signal Descriptions ............................................................................................................................................ 4-1
PICs and DDR Data (DQ) Pins Associated with the DDR Strobe (DQS) Pin .................................................... 4-3
Pin Information Summary................................................................................................................................... 4-4
Pin Information Summary (Cont.)....................................................................................................................... 4-5
Power Supply and NC Connections................................................................................................................... 4-6
Power Supply and NC Connections (Cont.)....................................................................................................... 4-7
LFEC1, LFEC3 Logic Signal Connections: 100 TQFP....................................................................................... 4-8
LFEC1, LFEC3, LFECP/EC6 Logic Signal Connections: 144 TQFP ............................................................... 4-11
LFEC1, LFEC3 Logic Signal Connections: 208 PQFP .................................................................................... 4-14
LFECP/EC6, LFECP/EC10 Logic Signal Connections: 208 PQFP.................................................................. 4-19
LFEC3 and LFECP/EC6 Logic Signal Connections: 256 fpBGA ..................................................................... 4-24
LFECP/EC10 and LFECP/EC15 Logic Signal Connections: 256 fpBGA......................................................... 4-31
LFECP/EC6, LFECP/EC10, LFECP/EC15 Logic Signal Connections: 484 fpBGA ......................................... 4-38
LFECP/EC20 and LFECP/EC33 Logic Signal Connections: 484 fpBGA......................................................... 4-49
LFECP/EC20, LFECP/EC33 Logic Signal Connections: 672 fpBGA............................................................... 4-62
Thermal Management ...................................................................................................................................... 4-80
IEEE 1149.1-Compliant Boundary Scan Testability................................................................................ 2-31
Device Configuration............................................................................................................................... 2-32
Internal Logic Analyzer Capability (ispTRACY)....................................................................................... 2-32
External Resistor..................................................................................................................................... 2-32
Oscillator ................................................................................................................................................. 2-33
LVDS......................................................................................................................................................... 3-7
Differential HSTL and SSTL...................................................................................................................... 3-8
LVDS25E .................................................................................................................................................. 3-8
BLVDS ...................................................................................................................................................... 3-9
LVPECL .................................................................................................................................................. 3-10
RSDS ...................................................................................................................................................... 3-11
Pin-to-Pin Performance (LVCMOS25 12mA Drive) ................................................................................ 3-12
Register-to-Register Performance1 ........................................................................................................ 3-12
PFU Timing Diagrams............................................................................................................................. 3-18
EBR Memory Timing Diagrams............................................................................................................... 3-19
Master Clock ........................................................................................................................................... 3-25
, ,
........................................................................................................... 3-21
2
LatticeECP/EC Family Data Sheet
Table of Contents
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