LFEC3E-3QN208I Lattice, LFEC3E-3QN208I Datasheet - Page 455

• Manufacturer Part Number: LFEC3E-3QN208I
• Description: IC FPGA 3KLUTS 208PQFP
• Manufacturer: Lattice
• Series: EC3r

Specifications of LFEC3E-3QN208I

• Number Of Logic Elements/cells: 3100
• Number Of Labs/clbs: -
• Total Ram Bits: 56320
• Number Of I /o: 145
• Number Of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C
• Package / Case: 208-BFQFP
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: Q6377645

Lattice Semiconductor
Figure 14-19. Edge View Camera Inspection
In the photos samples above, trained technicians and computer camera recognition equipment are used for inspec-
tion of the X-ray results, looking for voids, shorts, missing connections, contaminants, alignment or other gross fail-
ure mechanisms. For example, in Figure 14-19, the BGA ball connections appear to be squashed downward, with
mild distortion, insuring that proper oven profile temperatures were achieved.
These technologies help in the successful placement and long term use of BGAs in the industry’s latest products.
Further advancements have been made in material content to conform to environmental issues, toxic materials and
recycling. Another issue that relates to board design is the physical silkscreen logos and information related to
recycling, lead content and other hazardous waste components, strict adherence must be paid to these require-
ments. Although a documentation and silkscreen issue, it can become a challenge to fit this information on the
board in some cases due to component population and must be accounted for in overall board real estate.
PCB Design Support
Lattice provides a collection of PCB design resources at
including schematic libraries, PCB CAM viewers, technical notes, and BGA breakout and routing examples.
Technical Support Assistance
Hotline: 1-800-LATTICE (North America)
e-mail:
Internet:
[phone] (Outside North America)
[e-mail]
www.latticesemi.com
14-18
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PCB Layout Recommendations
for BGA Packages