LFEC3E-3QN208I Lattice, LFEC3E-3QN208I Datasheet - Page 447

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LFEC3E-3QN208I

Manufacturer Part Number
LFEC3E-3QN208I
Description
IC FPGA 3KLUTS 208PQFP
Manufacturer
Lattice
Series
EC3r

Specifications of LFEC3E-3QN208I

Number Of Logic Elements/cells
3100
Number Of Labs/clbs
-
Total Ram Bits
56320
Number Of I /o
145
Number Of Gates
-
Voltage - Supply
1.14 V ~ 1.26 V
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 100°C
Package / Case
208-BFQFP
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
Q6377645

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
LFEC3E-3QN208I
Manufacturer:
Lattice Semiconductor Corporation
Quantity:
10 000
Lattice Semiconductor
144-ball csBGA BGA Breakout Examples
These examples place an ispMACH 4000ZE in a 7x7 mm, 0.5 mm pitch, 144-ball csBGA package (LC4256ZE-
MN144) into two fabrication scenarios. One for a 6-layer stack up with maximum I/O utilization and a 4-layer with
about 5% fewer I/Os. The 6-layer (Example #1) design avoids uses of micro vias and takes advantage of removed
pads on inner layers to route all pins out to 6 layers with good layer structure for high-speed signal integrity.
Figure 14-8. CAM Artwork Screen Shots, Example #1, 144-ball csBGA
Layer 1 Primary
Layer 3 Signal
Layer 5 Power
14-10
Layer 6 Secondary
PCB Layout Recommendations
Layer 4 Signal
Layer 2 GND
for BGA Packages

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