LFEC3E-3QN208I Lattice, LFEC3E-3QN208I Datasheet - Page 456
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LFEC3E-3QN208I
Manufacturer Part Number
LFEC3E-3QN208I
Description
IC FPGA 3KLUTS 208PQFP
Manufacturer
Lattice
Series
EC3r
Datasheets
1.LFEC3E-5TN144C.pdf
(163 pages)
2.LFE3-35EA-8FN672I.pdf
(21 pages)
3.LFEC3E-3QN208I.pdf
(478 pages)
Specifications of LFEC3E-3QN208I
Number Of Logic Elements/cells
3100
Number Of Labs/clbs
-
Total Ram Bits
56320
Number Of I /o
145
Number Of Gates
-
Voltage - Supply
1.14 V ~ 1.26 V
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 100°C
Package / Case
208-BFQFP
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
Q6377645
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LFEC3E-3QN208I
Manufacturer:
Lattice Semiconductor Corporation
Quantity:
10 000
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Lattice Semiconductor
Revision History
September 2006
September 2010
November 2005
February 2010
January 2005
August 2010
March 2008
March 2010
June 2006
May 2009
Date
Version
01.0
01.1
01.2
01.3
01.4
01.5
01.6
01.7
01.8
01.9
Initial release.
Figures updated.
Removed NSMD content.
Added note to BGA Board Layout Recommendations table.
Reformatted BGA Package Types section in tabular format.
Revised recommended Solder Mask Defined and Non Solder Mask
Defined PCB solder pad dimensions to match industry standards.
Updated BGA Board Layout Recommendations table and BGA Pack-
age Types table for 0.4 mm pitch ucBGA package.
Edits to most sections and additional links and graphics added for each
example.
Replaced Lattice BGA Naming Conventions table with Lattice Semicon-
ductor BGA Package Types table and SMD/NSMD Pad Recommenda-
tions table.
Lattice Semiconductor SMD/NSMD Pad Recommendations table:
Specified nominal Solder Mask Opening for each Lattice BGA package,
clarified recommended Solder Mask Opening and Solder Pad Diame-
ters and added cautionary note.
Lattice Semiconductor SMD/NSMD Pad Recommendations table -
Added 64 csBGA to 0.5mm pitch column.
14-19
Change Summary
PCB Layout Recommendations
for BGA Packages
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