LFEC3E-3QN208I Lattice, LFEC3E-3QN208I Datasheet - Page 449

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LFEC3E-3QN208I

Manufacturer Part Number
LFEC3E-3QN208I
Description
IC FPGA 3KLUTS 208PQFP
Manufacturer
Lattice
Series
EC3r

Specifications of LFEC3E-3QN208I

Number Of Logic Elements/cells
3100
Number Of Labs/clbs
-
Total Ram Bits
56320
Number Of I /o
145
Number Of Gates
-
Voltage - Supply
1.14 V ~ 1.26 V
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 100°C
Package / Case
208-BFQFP
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
Q6377645

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
LFEC3E-3QN208I
Manufacturer:
Lattice Semiconductor Corporation
Quantity:
10 000
Lattice Semiconductor
256-ball caBGA BGA Breakout Examples
This BGA breakout and routing example places a MachXO PLD in a 14x14 mm, 0.8 mm pitch, 256-ball caBGA
package (LCMXO2280-B256/BN256) into two fabrication scenarios. One for a 6-layer stack up with maximum I/O
utilization and a 4-layer with about 10% fewer I/Os. The 6-layer design (Example #1), demonstrates the best use of
mechanically drill blind vias to place caps near power pins to minimize layers.
Figure 14-10. CAM Artwork Screen Shots, Example #1, 256-Ball caBGA
Layer 1 Primary
Layer 5 Signal
Layer 3 GND
14-12
Layer 6 Secondary
PCB Layout Recommendations
Layer 2 Signal
Layer 4 Power
for BGA Packages

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