AT91SAM9G45-EKES Atmel, AT91SAM9G45-EKES Datasheet - Page 1192

• Manufacturer Part Number: AT91SAM9G45-EKES
• Description: KIT EVAL FOR AT91SAM9G45
• Manufacturer: Atmel
• Series: AT91SAM Smart ARMr
• Type: MCUr

Specifications of AT91SAM9G45-EKES

• Contents: Board
• Processor To Be Evaluated: SAM9G45
• Data Bus Width: 32 bit
• Interface Type: I2C, SPI, UART
• Maximum Operating Temperature: + 50 C
• Minimum Operating Temperature: - 10 C
• Operating Supply Voltage: 1.8 V to 3.3 V
• For Use With/related Products: AT91SAM9G45
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: Q4626953

Table 47-1.
Table 47-2.
Table 47-3.
Table 47-4.
47.2
1192
Ball Land
Soldering Mask Opening
400
Moisture Sensitivity Level
JEDEC Drawing Reference
JESD97 Classification
Soldering Profile
AT91SAM9G45
Soldering Information
Device and 324-ball TFBGA Package Maximum Weight
324-ball TFBGA Package Characteristics
Package Reference
This package respects the recommendations of the NEMI User Group.
Table 47-5
Table 47-5.
Note:
A maximum of three reflow passes is allowed per component.
Profile Feature
Average Ramp-up Rate (217°C to Peak)
Preheat Temperature 175°C ±25°C
Temperature Maintained Above 217°C
Time within 5 C of Actual Peak Temperature
Peak Temperature Range
Ramp-down Rate
Time 25 C to Peak Temperature
It is recommended to apply a soldering temperature higher than 250°C
gives the recommended soldering profile from J-STD-020C.
Soldering Profile
mg
0.4 mm +/- 0.05
0.275 mm +/- 0.03
3
MO-210
e1
Green Package
3 C/sec. max.
180 sec. max.
60 sec. to 150 sec.
20 sec. to 40 sec.
260 +0 C
6 C/sec. max.
8 min. max.
6438F–ATARM–21-Jun-10