AT91SAM9G45-CU Atmel, AT91SAM9G45-CU Datasheet - Page 1161

• Manufacturer Part Number: AT91SAM9G45-CU
• Description: MCU ARM9 324-TFBGA
• Manufacturer: Atmel
• Series: AT91SAMr

Specifications of AT91SAM9G45-CU

• Core Processor: ARM9
• Core Size: 16/32-Bit
• Speed: 400MHz
• Connectivity: EBI/EMI, Ethernet, I²C, IrDA, MMC, SPI, SSC, UART/USART, USB
• Peripherals: AC'97, DMA, I²S, LCD, POR, PWM, WDT
• Number Of I /o: 160
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: ROM
• Ram Size: 128K x 8
• Voltage - Supply (vcc/vdd): 0.9 V ~ 1.1 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 324-TFBGA
• Processor Series: AT91SAMx
• Core: ARM926EJ-S
• Data Bus Width: 32 bit
• Data Ram Size: 64 KB
• Interface Type: I2C, SPI, UART
• Maximum Clock Frequency: 800 MHz
• Number Of Programmable I/os: 160
• Number Of Timers: 5
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: JTRACE-ARM-2M, MDK-ARM, RL-ARM, ULINK2
• Development Tools By Supplier: AT91SAM-ICE, AT91-ISP
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit
• Controller Family/series: AT91
• No. Of I/o's: 160
• Ram Memory Size: 64KB
• Cpu Speed: 400MHz
• No. Of Timers: 2
• Rohs Compliant: Yes
• For Use With: AT91SAM9G45-EKES - KIT EVAL FOR AT91SAM9G45
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

46.4
46.4.1
Table 46-5.
46.4.2
Table 46-6.
46.5
Table 46-7.
Note:
6438F–ATARM–21-Jun-10
Symbol
1/(t
Symbol
1/(t
Symbol
1/(t
C
C
C
t
I
P
I
ST
DDST
DD ON
ON
CRYSTAL
INT
LEXT
CPPCK
CPMCK
CPMAIN
(1)
Clock Characteristics
Main Oscillator Characteristics
1. The C
(1)
)
)
)
Processor Clock Characteristics
Master Clock Characteristics
asitic capacitance, package and board, must be calculated in order to reach 15 pF (minimum targeted load for the
oscillator) by taking into account the internal load C
tance must be: 15 pF - 4 pF = 11 pF which means that 22 pF is the target value (22 pF from xin to gnd and 22 pF from xout
to gnd) If 20 pF load is targeted, the sum of pad, package, board and external capacitances must be 20 pF - 4 pF = 16 pF
which means 32 pF (32 pF from xin to gnd and 32 pF from xout to gnd).
Parameter
Crystal Oscillator Frequency
Crystal Load Capacitance
Internal Load Capacitance
External Load Capacitance
Duty Cycle
Startup Time
Standby Current Consumption
Drive Level
Current Dissipation
Processor Clock Waveform Parameters
Master Clock Waveform Parameters
Main Oscillator Characteristics
CRYSTAL
Parameter
Processor Clock Frequency
Parameter
Master Clock Frequency
value is specified by the crystal manufacturer. In our case, C
The master clock is the maximum clock at which the system is able to run. It is given by the
smallest value of the internal bus clock and EBI clock.
Note:
1. For DDR2 usage, there are no limitations to LDDDR, SDRAM and mobile SDRAM.
Conditions
C
C
Standby mode
@ 8 MHz
@ 16 MHz
CRYSTAL
CRYSTAL
Conditions
VDDCORE = 0.9V
T = 85°C
Conditions
VDDCORE = 0.9V
T = 85°C
= 15 pF
= 20 pF
INT
(1)
(1)
. So, to target the minimum oscillator load of 15 pF, external capaci-
CRYSTAL
0.35
Min
125
125
0.7
15
40
Min
Min
8
(1)
(1)
must be between 15 pf and 20 pF. All par-
Typ
AT91SAM9G45
12
22
32
50
4
Max
Max
400
133
Max
0.55
150
1.1
16
20
60
2
1
Units
Units
MHz
MHz
MHz
Unit
μW
mA
mA
ms
pF
pF
pF
μA
Pf
%
1161