AT91SAM9G45-CU Atmel, AT91SAM9G45-CU Datasheet - Page 17

MCU ARM9 324-TFBGA

AT91SAM9G45-CU

Manufacturer Part Number
AT91SAM9G45-CU
Description
MCU ARM9 324-TFBGA
Manufacturer
Atmel
Series
AT91SAMr

Specifications of AT91SAM9G45-CU

Core Processor
ARM9
Core Size
16/32-Bit
Speed
400MHz
Connectivity
EBI/EMI, Ethernet, I²C, IrDA, MMC, SPI, SSC, UART/USART, USB
Peripherals
AC'97, DMA, I²S, LCD, POR, PWM, WDT
Number Of I /o
160
Program Memory Size
64KB (64K x 8)
Program Memory Type
ROM
Ram Size
128K x 8
Voltage - Supply (vcc/vdd)
0.9 V ~ 1.1 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
324-TFBGA
Processor Series
AT91SAMx
Core
ARM926EJ-S
Data Bus Width
32 bit
Data Ram Size
64 KB
Interface Type
I2C, SPI, UART
Maximum Clock Frequency
800 MHz
Number Of Programmable I/os
160
Number Of Timers
5
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
JTRACE-ARM-2M, MDK-ARM, RL-ARM, ULINK2
Development Tools By Supplier
AT91SAM-ICE, AT91-ISP
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit
Controller Family/series
AT91
No. Of I/o's
160
Ram Memory Size
64KB
Cpu Speed
400MHz
No. Of Timers
2
Rohs Compliant
Yes
For Use With
AT91SAM9G45-EKES - KIT EVAL FOR AT91SAM9G45
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

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6.2.2
Table 6-1.
6.2.3
6.3
6.3.1
6.3.2
6438F–ATARM–21-Jun-10
seen at 0x100000 through AHB
SRAM A ITCM size (KBytes)
I/O Drive Selection and Delay Control
TCM Interface
Internal ROM
I/O Drive Selection
Delay Control
ITCM and DTCM Memory Configuration
32
0
0
On the processor side, this Internal SRAM can be allocated to two areas.
Within the 64Kbyte SRAM size available, the amount of memory assigned to each block is soft-
ware programmable according to
The AT91SAM9G45 embeds an Internal ROM, which contains the boot ROM and SAM-BA
program.
At any time, the ROM is mapped at address 0x0040 0000. It is also accessible at address 0x0
(BMS =1) after the reset and before the Remap Command.
The aim of this control is to adapt the signal drive to the frequency. Two bits allow the user to
select High or Low drive for memories data/address/ctrl signals.
To avoid the simultaneous switching of all the I/Os, a delay can be inserted on the different EBI,
DDR2 and PIO lines.
• Internal SRAM A is the ARM926EJ-S Instruction TCM. The user can map this SRAM block
• Internal SRAM B is the ARM926EJ-S Data TCM. The user can map this SRAM block
• Internal SRAM C is only accessible by all the AHB Masters. After reset and until the Remap
• Setting the bit [17], EBI_DRIVE, in the EBI_CSA register of the matrix allows to control the
• Setting the bit [18], DDR_DRIVE, in the EBI_CSA register of the matrix allows to control the
anywhere in the ARM926 instruction memory space using CP15 instructions and the TCR
configuration register located in the Chip Configuration User Interface. This SRAM block is
also accessible by the ARM926 Masters and by the AHB Masters through the AHB bus
anywhere in the ARM926 data memory space using CP15 instructions. This SRAM block is
also accessible by the ARM926 Data Master and by the AHB Masters through the AHB bus.
Command is performed, this SRAM block is accessible through the AHB bus at address
0x0030 0000 by all the AHB Masters. After Remap, this SRAM block also becomes
accessible through the AHB bus at address 0x0 by the ARM926 Instruction and the ARM926
Data Masters.
drive of the EBI.
drive of the DDR.
seen at 0x200000 through AHB
SRAM B DTCM size (KBytes)
64
32
0
Table
6-1.
seen at 0x300000 through AHB
SRAM C (KBytes)
64
0
0
AT91SAM9G45
17
®

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