DF2437FV Renesas Electronics America, DF2437FV Datasheet - Page 23

• Manufacturer Part Number: DF2437FV
• Description: IC H8S/2437 MCU FLASH 128QFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2400r

Specifications of DF2437FV

• Core Processor: H8S/2600
• Core Size: 16-Bit
• Speed: 20MHz
• Connectivity: I²C, SCI
• Peripherals: POR, PWM, WDT
• Number Of I /o: 85
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 128-QFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

21.3 Duty Adjustment Circuit ...................................................................................................643
21.4 Divider ..............................................................................................................................643
21.5 Usage Notes ......................................................................................................................644
Section 22 Power-Down Modes ....................................................................... 645
22.1 Register Descriptions ........................................................................................................648
22.2 Operation...........................................................................................................................652
22.3 φ Clock Output Control.....................................................................................................658
22.4 Usage Notes ......................................................................................................................659
Section 23 List of Registers .............................................................................. 661
23.1 Register Addresses (Address Order) .................................................................................662
23.2 Register Bits......................................................................................................................674
23.3 Register States in Each Operating Mode...........................................................................686
Section 24 Electrical Characteristics ................................................................ 697
24.1 Absolute Maximum Ratings .............................................................................................697
24.2 DC Characteristics ............................................................................................................698
24.3 AC Characteristics ............................................................................................................701
21.2.1 Connecting Crystal Resonator .............................................................................640
21.2.2 External Clock Input Method...............................................................................641
21.5.1 Note on Resonator................................................................................................644
21.5.2 Notes on Board Design ........................................................................................644
21.5.3 Notes on Operation Confirmation........................................................................644
22.1.1 Standby Control Register (SBYCR) ....................................................................648
22.1.2 Module Stop Control Registers H and L (MSTPCRH, MSTPCRL)....................650
22.1.3 Extension Module Stop Control Registers H and L
22.2.1 Clock Division Mode...........................................................................................652
22.2.2 Sleep Mode ..........................................................................................................652
22.2.3 Software Standby Mode.......................................................................................653
22.2.4 Hardware Standby Mode .....................................................................................656
22.2.5 Module Stop Mode ..............................................................................................657
22.4.1 I/O Port State........................................................................................................659
22.4.2 Current Consumption during Oscillation Stabilization Standby Period...............659
22.4.3 On-Chip Peripheral Module Interrupts ................................................................659
22.4.4 Writing to MSTPCR, EXMSTPCR .....................................................................659
22.4.5 Notes on Clock Division Mode............................................................................659
24.3.1 Clock Timing .......................................................................................................701
24.3.2 Control Signal Timing .........................................................................................704
24.3.3 Bus Timing ..........................................................................................................706
24.3.4 Timing of On-Chip Peripheral Modules ..............................................................714
(EXMSTPCRH, EXMSTPCRL)..........................................................................651
Rev.2.00 May. 28, 2009 Page xxi of xxxviii
REJ09B0059-0200