DF2437FV Renesas Electronics America, DF2437FV Datasheet - Page 593

IC H8S/2437 MCU FLASH 128QFP

DF2437FV

Manufacturer Part Number
DF2437FV
Description
IC H8S/2437 MCU FLASH 128QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2400r
Datasheets

Specifications of DF2437FV

Core Processor
H8S/2600
Core Size
16-Bit
Speed
20MHz
Connectivity
I²C, SCI
Peripherals
POR, PWM, WDT
Number Of I /o
85
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 16x10b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
128-QFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF2437FV
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Section 20 Flash Memory (0.18-μm F-ZTAT Version)
20.1.3
Flash Memory MAT Configuration
This LSI’s flash memory consists of the 256-kbyte user MAT and 8-kbyte user boot MAT.
The start address is allocated to the same address in the user MAT and user boot MAT. Therefore,
when the program execution or data access is performed between two MATs, the MAT must be
switched by using FMATS.
The user MAT or user boot MAT can be read in all modes. However, the user boot MAT can be
programmed only in boot mode and programmer mode.
<User MAT>
<User Boot MAT>
Address H'000000
Address H'000000
8 kbytes
Address H'001FFF
256 kbytes
Address H'03FFFF
Figure 20.3 Flash Memory Configuration
The size of the user MAT is different from that of the user boot MAT. An address which exceeds
the size of the 8-kbyte user boot MAT should not be accessed. If the attempt is made, an undefined
value will be read.
Rev.2.00 May. 28, 2009 Page 553 of 732
REJ09B0059-0200

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