DF2437FV Renesas Electronics America, DF2437FV Datasheet - Page 631

IC H8S/2437 MCU FLASH 128QFP

DF2437FV

Manufacturer Part Number
DF2437FV
Description
IC H8S/2437 MCU FLASH 128QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2400r
Datasheets

Specifications of DF2437FV

Core Processor
H8S/2600
Core Size
16-Bit
Speed
20MHz
Connectivity
I²C, SCI
Peripherals
POR, PWM, WDT
Number Of I /o
85
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 16x10b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
128-QFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF2437FV
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Section 20 Flash Memory (0.18-μm F-ZTAT Version)
read is undetermined. Perform MAT switching in accordance with the description in section 20.6,
Switching between User MAT and User Boot MAT.
Except for MAT switching, the programming procedure is the same as that in user program mode.
The area that can be executed in the steps of the user procedure program (on-chip RAM, user
MAT, and external space) is shown in section 20.4.4, Storable Area for Procedure Program and
Program Data.
(3) User MAT Erasing in User Boot Mode
For erasing the user MAT in user boot mode, additional processing made by setting FMATS is
required: switching from user-boot-MAT selection state to user-MAT selection state, and
switching back to user-boot-MAT selection state after erasing completes.
Figure 20.15 shows the procedure for erasing the user MAT in user boot mode.
Rev.2.00 May. 28, 2009 Page 591 of 732
REJ09B0059-0200

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