HD64F3029XBL25V Renesas Electronics America, HD64F3029XBL25V Datasheet - Page 1001

MCU 5V 512K,PB-FREE 100-TQFP

HD64F3029XBL25V

Manufacturer Part Number
HD64F3029XBL25V
Description
MCU 5V 512K,PB-FREE 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet

Specifications of HD64F3029XBL25V

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, PWM, WDT
Number Of I /o
70
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
H.1
1
2
3
4
Rev. 2.0, 06/04, page 972 of 980
Item
Operating
mode
Interrupt
controller
Bus
controller
DRAM
interface
Appendix H Comparison of H8/300H Series Product
Differences between H8/3029, H8/3069R, H8/3067 Group and
H8/3062 Group, H8/3048 Group, H8/3007 and H8/3006, and H8/3002
Mode 5
Mode 6
Internal
interrupt
sources
Burst ROM
interface
Idle cycle
insertion
function
Wait mode 2 modes
Wait state
number
setting
Address
output
method
Connect-
able areas
H8/3069R,
H8/3029
16 Mbytes ROM
enabled expanded
mode
36
Yes
Yes
Per area
Choice of address
update fixed
Area 2/3/4/5
Specifications
H8/3067 Group,
H8/3062 Group
16 Mbytes ROM
enabled expanded
mode
64 kbytes single-chip
mode
36 (H8/3067)
27 (H8/3062)
Yes (H8/3067)
No (H8/3062)
Yes
2 modes
Per area
Choice of address
update mode (fixed in
H8/3067F-ZTAT and
H8/3062F-ZTAT)
Area 2/3/4/5
(H8/3067 only)
H8/3048
Group
1 Mbyte ROM
enabled
expanded
mode
16 Mbyte
ROM enabled
expanded
mode
30
No
No
4 modes
Common
to all areas
Fixed
Area 3
H8/3007,
H8/3006
36
Yes
Yes
2 modes
Per area
Fixed
Area 2/3/4/5
H8/3002
30
No
No
4 modes
Common
to all areas
Fixed
Area 3

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