HD64F3029XBL25V Renesas Electronics America, HD64F3029XBL25V Datasheet - Page 561

• Manufacturer Part Number: HD64F3029XBL25V
• Description: MCU 5V 512K,PB-FREE 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3029XBL25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

If the TXI interrupt activates the DMAC, the number of bytes designated in the DMAC can be
transmitted automatically, including automatic retransmission.
For details, see Interrupt Operations and Data Transfer by DMAC in this section.
Rev. 2.0, 06/04, page 532 of 980
(1) GM = 0
(2) GM = 1
Serial data
TEND
TEND
Ds
Figure 14.4 Timing of TEND Flag Setting
11.0 etu
12.5 etu
Dp
Guard time
DE