HD64F3029XBL25V Renesas Electronics America, HD64F3029XBL25V Datasheet - Page 568

• Manufacturer Part Number: HD64F3029XBL25V
• Description: MCU 5V 512K,PB-FREE 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3029XBL25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

14.4
The following points should be noted when using the SCI as a smart card interface.
Receive Data Sampling Timing and Receive Margin in Smart Card Interface Mode: In smart
card interface mode, the SCI operates on a base clock with a frequency of 372 times the transfer
rate. In reception, the SCI synchronizes internally with the fall of the start bit, which it samples on
the base clock. Receive data is latched at the rising edge of the 186th base clock pulse. The timing
is shown in figure 14.11.
Internal base
clock
Receive data
(RxD)
Synchronization
sampling timing
Data sampling
timing
Figure 14.11 Receive Data Sampling Timing in Smart Card Interface Mode
Usage Notes
0
186 clocks
185
372 clocks
Start bit
371
0
D0
Rev. 2.0, 06/04, page 539 of 980
185
371 0
D1