HD64F3029XBL25V Renesas Electronics America, HD64F3029XBL25V Datasheet - Page 704

MCU 5V 512K,PB-FREE 100-TQFP

HD64F3029XBL25V

Manufacturer Part Number
HD64F3029XBL25V
Description
MCU 5V 512K,PB-FREE 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet

Specifications of HD64F3029XBL25V

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, PWM, WDT
Number Of I /o
70
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Table 18.23 AC Characteristics Auto-Write Mode
Condition : V
Code
Command write cycle
CE hold time
CE setup time
Data hold time
Data setup time
Programming pulse width
Status polling start time
Status polling access time
Address setup time
Address hold time
Memory programming time
Programming setup time
Programming end setup
time
WE rise time
WE fall time
I/O5-0
A18-0
FWE
I/O7
I/O6
WE
OE
CE
t
pns
CC
= 3.0 V to 3.6 V, V
t
ces
tf
t
ds
t
wep
H'40 or
H'45
Figure 18.33 Timing in Auto-Write Mode
t
Symbol
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
tr
ceh
nxtc
ceh
ces
dh
ds
wep
wsts
spa
as
ah
write
pns
pnh
r
f
t
dh
t
nxtc
SS
= 0 V, T
Address Stable
t
as
Min
20
0
0
50
50
70
1
0
60
1
100
100
1st byte
Din
a
= 25°C ± 5°C
Data Transfer
1 byte to 128 bytes
t
ah
Max
150
3000
30
30
128th byte
Din
t
wsts
Rev. 2.0, 06/04, page 675 of 980
Unit
µs
ns
ns
ns
ns
ns
ms
ns
ns
ns
ms
ns
ns
ns
ns
t
write
t
spa
H'00
Identification Signal of
Programming Operation End
Identification Signal of
Programming Operation
Successful End
t
pnh
Note
t
nxtc

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