HD64F3029XBL25V Renesas Electronics America, HD64F3029XBL25V Datasheet - Page 994

• Manufacturer Part Number: HD64F3029XBL25V
• Description: MCU 5V 512K,PB-FREE 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3029XBL25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

D.2
Modes 1 and 2: Figure D.1 is a timing diagram for the case in which RES goes low during an
external memory access in mode 1 or 2. As soon as RES goes low, all ports are initialized to the
input state. AS, RD, HWR, LWR, and CS
The address bus is initialized to the low output level 2.5 clock cycles after the low level of RES
is sampled. Clock pin P6
P6
Internal reset
signal
A
(read)
(write)
D
(write)
I/O port,
19
15
7
,
0
7
Pin States at Reset
/
to A
to D
to
,
0
0
1
Figure D.1 Reset during Memory Access (Modes 1 and 2)
7
/ goes to the output state at the next rise of after RES goes low.
Access to external
T1
memory
0
go high, and D
T2
T3
15
to D
0
go to the high-impedance state.
Rev. 2.0, 06/04, page 965 of 980
High impedance
High impedance
H'00000