HD64F3029XBL25V Renesas Electronics America, HD64F3029XBL25V Datasheet - Page 725

• Manufacturer Part Number: HD64F3029XBL25V
• Description: MCU 5V 512K,PB-FREE 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3029XBL25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

19.5.3
The DIVCR setting changes the frequency, so note the following points.
Rev. 2.0, 06/04, page 696 of 980
Select a frequency division ratio that stays within the assured operation range specified for the
clock cycle time t
operating frequency range. Ensure that is not below this lower limit.
All on-chip module operations are based on . Note that the timing of timer operations, serial
communication, and other time-dependent processing differs before and after any change in
the division ratio. The waiting time for exit from software standby mode also changes when
the division ratio is changed. For details, see section 20.4.3, Selection of Waiting Time for
Exit from Software Standby Mode.
Usage Notes
cyc
in the AC electrical characteristics. Note that
min
= lower limit of the