HD64F3029XBL25V Renesas Electronics America, HD64F3029XBL25V Datasheet - Page 486

• Manufacturer Part Number: HD64F3029XBL25V
• Description: MCU 5V 512K,PB-FREE 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3029XBL25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

13.1.2
Figure 13.1 shows a block diagram of the SCI.
RxD
TxD
SCK
Legend
RSR
RDR
TSR
TDR
SMR
SCR
SSR
BRR
SCMR : Smart card mode register
Block Diagram
RDR
RSR
: Receive shift register
: Receive data register
: Transmit shift register
: Transmit data register
: Serial mode register
: Serial control register
: Serial status register
: Bit rate register
Parity generate
Parity check
TSR
TDR
Module data bus
Figure 13.1 SCI Block Diagram
Transmit/receive
control
SCMR
SMR
SSR
SCR
External clock
Clock
Baud rate
generator
BRR
Rev. 2.0, 06/04, page 457 of 980
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T X I
R X I
E R I
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Internal data bus